MC13213 Freescale Semiconductor, MC13213 Datasheet - Page 64

• Manufacturer Part Number: MC13213
• Description: IC TXRX RF 2.4GHZ FLSH 60K 71LGA
• Manufacturer: Freescale Semiconductor
• Series: MC1321xr

Specifications of MC13213

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4 Zigbee
• Applications: General Purpose
• Power - Output: 3dBm
• Sensitivity: -92dBm
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 42mA
• Current - Transmitting: 35mA
• Data Interface: PCB, Surface Mount
• Memory Size: 60kB Flash, 4kB RAM
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 71-LGA
• Number Of Receivers: 1
• Number Of Transmitters: 1
• Wireless Frequency: 2.4 GHz to 2.48 GHz
• Interface Type: SPI
• Output Power: 0 dBm to 2 dBm
• Operating Supply Voltage: 2 V to 3.4 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Supply Current: 42 mA
• Minimum Operating Temperature: - 40 C
• Protocol Supported: 802.15.4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Since the MC1321x contains an on-chip reference frequency trim capability, it is possible to trim out
virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board
basis. Individual trimming of each board in a production environment allows use of the lowest cost crystal,
but requires that each board go through a trimming procedure. This step can be avoided by
using/specifying a crystal with a tighter stability tolerance, but the crystal will be slightly higher in cost.
A tolerance analysis budget may be created using all the previously stated factors. It is an engineering
judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if
the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging
factor is usually specified in ppm/year and the product designer can determine how many years are to be
assumed for the product lifetime. Taking all of the factors into account, the product designer can determine
the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.
7.1.2
The suggested crystal specification for the MC1321x is shown in
parameters are related to desired package, desired temperature range and use of crystal capacitive load
trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, and MC1321x.
64
Frequency
Frequency tolerance (cut tolerance)
Frequency stability (temperature drift)
Aging
Equivalent series resistance
Load capacitance
Crystal Requirements
4
Parameter
6
Y1 = Daishinku KDS - DSX321G ZD00882
Figure 34. MC1321x Modem Crystal Circuit
5
Table 22. MC1321x Crystal Specifications
MC13211/212/213 Technical Data, Rev. 1.8
U3
MC1321x
XTAL1
XTAL2
2
3
16.000000
27
28
Value
5 - 9
± 10
± 15
± 2
43
Y1
16MHz
MHz
Unit
ppm
ppm
ppm
pF
Ω
at 25 °C
Over desired temperature range
max
max
Table
C10
6.8pF
C11
6.8pF
22. A number of the stated
1
Condition
Freescale Semiconductor