TDA6651TT/C3,118 NXP Semiconductors, TDA6651TT/C3,118 Datasheet - Page 20

• Manufacturer Part Number: TDA6651TT/C3,118
• Description: IC MXR/OSC AND SYNTH 38-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of TDA6651TT/C3,118

• Function: Mixer
• Package / Case: 38-TFSOP (0.173", 4.40mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935277153118

NXP Semiconductors
11. Thermal characteristics
TDA6650TT_6651TT_5
Product data sheet
Table 20.
In accordance with the Absolute Maximum Rating System (IEC 60134). Positive currents are
entering the IC and negative currents are going out of the IC; all voltages are referenced to ground
[1]
[1]
[2]
Table 21.
[1]
[2]
[3]
Symbol
V
I
I
t
T
T
T
Symbol
R
BSn
BS(tot)
sc(max)
.
stg
amb
j
n
th(j-a)
Maximum ratings cannot be exceeded, not even momentarily without causing irreversible IC damage.
Maximum ratings cannot be accumulated.
The maximum allowed ambient temperature T
and especially on the design of the printed-circuit board. The application mounting must be done in such a
way that the maximum junction temperature is never exceeded. An estimation of the junction temperature
can be obtained through measurement of the temperature of the top center of the package (T
temperature difference junction to case ( T
The junction temperature: T
Measured in free air as defined by JEDEC standard JESD51-2.
These values are given for information only. The thermal resistance depends strongly on the nature and
design of the printed-circuit board used in the application.The thermal resistance given corresponds to the
value that can be measured on a multilayer printed-circuit board (4 layers) as defined by JEDEC standard.
The junction temperature influences strongly the reliability of an IC. The printed-circuit board used in the
application contributes in a large part to the overall thermal characteristic. It must therefore be insured that
the junction temperature of the IC never exceeds T
Limiting values
Thermal characteristics
Parameter
voltage on all other inputs,
outputs and combined
inputs and outputs, except
grounds
PMOS port output current
sum of all PMOS port output
currents
maximum short-circuit time
storage temperature
ambient temperature
junction temperature
Parameter
thermal resistance from
junction to ambient
TDA6650TT
TDA6651TT
Rev. 05 — 10 January 2007
…continued
j
= T
package
5 V mixer/oscillator and low noise PLL synthesizer
+ T
Conditions
in free air
TDA6650TT; TDA6651TT
j-c
Conditions
4.5 V < V
corresponding port
on; open-drain
open-drain
each pin to V
to ground
j-c
) is estimated at about 13 C on the demo board (PCB 827-3).
.
amb(max)
j(max)
CC
depends on the assembly conditions of the package
= 150 C at the maximum ambient temperature.
< 5.5 V
CC
or
[1][2][3]
[2]
Min
-
-
Typ
82
74
0.3
20
50
40
20
Max
V
0
0
10
+150
T
150
© NXP B.V. 2007. All rights reserved.
amb(max)
CC
+ 0.3
Unit
K/W
K/W
package
20 of 54
Unit
V
mA
mA
s
). The
C
C
C