RF5110GPCK-410 RFMD, RF5110GPCK-410 Datasheet - Page 18

• Manufacturer Part Number: RF5110GPCK-410
• Description: KIT EVAL FOR RF5110G
• Manufacturer: RFMD
• Type: Amplifierr

Specifications of RF5110GPCK-410

• Frequency: 800MHz ~ 950MHz
• For Use With/related Products: RF5110G
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 689-1054; RF5110GPCBA-410

RF5110G
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
Figure 2. PCB Solder Mask Pattern (Top View)
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
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0.50
Typ.
0.55
Typ.
Pin 1
0.55
Typ.
Pin 16
0.50
Typ.
A
A
A
A
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 1.60 (mm) Sq.
B
B
B
B
1.50
Typ.
C
B
B
0.75
Typ.
B
B
Pin 8
A
A
A
A
Dimensions in
mm.
Pin 12
0.75
Typ.
1.50
Typ.
Rev A4 DS071026