RF5110 RF Micro Devices, RF5110 Datasheet
RF5110
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RF5110 Summary of contents
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... GSM Cellular Handsets • 3V Dual-Band/Triple-Band Handsets • GPRS Compatible Product Description The RF5110 is a high-power, high-efficiency power ampli- fier module offering high performance in GSM OR GPRS applications. The device is manufactured on an advanced GaAs HBT process, and has been designed for use as ...
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... RF5110 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (V ) APC1,2 DC Supply Current Input RF Power Duty Cycle at Max Power Output Load VSWR Operating Case Temperature Storage Temperature Parameter Min. Overall Operating Frequency Range Usable Frequency Range Maximum Output Power 33.8 33.1 Total Efficiency Input Power for Max Output +4 ...
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... Power Supply Power Supply Voltage Power Supply Current Rev A0 050318 Specification Typ. Max. 3.5 2.7 4.8 5 200 335 RF5110 Unit Condition V Specifications V Nominal operating limits, P OUT V With maximum output load VSWR 6:1, P <+35dBm OUT A DC Current at P OUT,MAX mA Idle Current, P <-30dBm IN μ ...
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... RF5110 Pin Function Description 1 VCC1 Power supply for the pre-amplifier stage and interstage matching. This pin forms the shunt inductance needed for proper tuning of the inter- stage match. Refer to the application schematic for proper configura- tion. Note that position and value of the components are important. ...
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... Theory of Operation and Application Information The RF5110 is a three-stage device with 32 dB gain at full power. Therefore, the drive required to fully saturate the out- put is +3dBm. Based upon HBT (Heterojunction Bipolar Transistor) technology, the part requires only a single positive 3V supply to operate to full specification. Power control is provided through a single pin interface, with a separate Power Down control pin ...
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... RF5110 VCC1 5 Ω Ω 1.0 kΩ APC1 PKG BASE 2-6 Internal Schematic VCC2 4.5 pF APC1 VCC 400 Ω GND2 RF OUT APC2 VCC 300 Ω PKG BASE Rev A0 050318 ...
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... C14 8 mils C9 C10 and C10 share the same pad RF5110 P1-1 VCC P2-1 1 P1-2 2 VCC 2 3 GND 3 CON3 GND 4 CON4 L4 C12 50 Ω μstrip 1 mils 40 mils C11 9.1 pF VAPC ...
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... RF5110 Evaluation Board Schematic 50 Ω μstrip J3 VAPC VAPC VCC1 C2 C3 C19 Ω μstrip 180 Ω Ω Ferrite 1.6 nH VCC2 + C21 C5 C6 C20 3.3 μ 2-8 GSM900 Lumped Element VCC C17 C16 C15 ...
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... Board Thickness 0.032”; Board Material FR-4; Multi-Layer Rev A0 050318 Evaluation Board Layout Board Size 2.0” x 2.0” RF5110 2-9 ...
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... Pulse Generator Notes about testing the RF5110 The test setup shown above includes two attenuators. The 3dB pad at the input is to minimize the effect on the signal generator as a result of switching the input impedance of the PA. When V impedance change can cause the signal generator to vary its output signal, either in output level or in frequency. Instead of an attenuator an isolator may also be used ...
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... PCB Metal Land Pattern 0.50 Typ. 0.55 Typ. Figure 1. PCB Metal Land Pattern (Top View) Rev A0 050318 PCB Design Requirements A = 0.64 x 0.28 (mm) Typ 0.28 x 0.64 (mm) Typ 1.50 (mm) Sq. Dimensions in mm. 1.50 Typ. 0.50 Typ. Pin Pin Pin 8 0.55 Typ. 0.75 Typ. RF5110 Pin 12 A 0.75 Typ. A 1.50 Typ 2-11 ...
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... RF5110 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier ...