CLP200M STMicroelectronics, CLP200M Datasheet - Page 19

• Manufacturer Part Number: CLP200M
• Description: IC OVP/OCP TELECOM POWERSO-10
• Manufacturer: STMicroelectronics

Specifications of CLP200M

• Voltage - Working: 200V
• Technology: Mixed Technology
• Number Of Circuits: 2
• Applications: Telecommunications
• Package / Case: PowerSO-10 Exposed Bottom Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Clamping: -

A new technology available today is IMS - an Insu-
lated Metallic Substrate. This offers greatly en-
hanced
mount components. IMS is a substrate consisting
of three different layers, (I) the base material which
is available as an aluminium or a copper plate, (II)
a thermal conductive dielectrical layer and (III) a
copper foil, which can be etched as a circuit layer.
Using this material a thermal resistance of 8°C/W
with 40 cm
(see fig. 4). If even higher power is to be dissipated
Fig 4 : Mounting on metal backed board
The PowerSO-10 concept also represents an at-
tractive
PowerSO-10 offers devices fully tested at low and
high temperature. Mounting is simple - only con-
ventional SMT is required - enabling the users to
get rid of bond wire problems and the problem to
TABLE 1 : THERMAL IMPEDANCE VERSUS SUBSTRATE
(*) Based on a delta T of 70 °C junction train.
1.FR4 using the recommended pad-layout
2.FR4 with heatsink on board (6cm
3.FR4 with copper-filled through holes and external heatsink applied
4. IMS floating in air (40 cm
5. IMS with external heatsink applied
Copper foil
thermal
alternative
2
of board floating in air is achievable
PowerSo-10 package mounted on
characteristics
Aluminium
to
C.O.B.
2
)
Insulation
2
for
)
techniques.
surface
an external heatsink could be applied which leads
to an R
that R
tion-heatsink). This is commonly applied in prac-
tice, leading to reasonable heatsink dimensions.
Often power devices are defined by considering
the maximum junction temperature of the device.
In practice , however, this is far from being ex-
ploited. A summary of various power management
capabilities is made in table 1 based on a reason-
able delta T of 70°C junction to air.
Fig 5 : Mounting on metal backed board with an
external heatsink applied
control the high temperature soft soldering as well.
An optimized thermal management is guaranteed
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
being mounted onto the substrate.
Copper foil
th
th
(j-a) of 3.5°C/W (see Fig. 5), assuming
(heatsink-air) is equal to R
Aluminium
3.5 °C/W
50 °C/W
35 °C/W
12 °C/W
heatsink
R
8 °C/W
th
(j-a)
P Diss (*)
FR4 board
CLP200M
1.5 W
2.0 W
5.8 W
8.8 W
20 W
th
(junc-
19/21