CLP200M STMicroelectronics, CLP200M Datasheet - Page 18
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CLP200M
Manufacturer Part Number
CLP200M
Description
IC OVP/OCP TELECOM POWERSO-10
Manufacturer
STMicroelectronics
Datasheet
1.CLP200M.pdf
(21 pages)
Specifications of CLP200M
Voltage - Working
200V
Technology
Mixed Technology
Number Of Circuits
2
Applications
Telecommunications
Package / Case
PowerSO-10 Exposed Bottom Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Voltage - Clamping
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CLP200M
Manufacturer:
WAVECOM
Quantity:
200
Part Number:
CLP200M
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
CLP200M-TR
Manufacturer:
TI
Quantity:
154
Company:
Part Number:
CLP200MC
Manufacturer:
ST
Quantity:
1 200
Fig 3 : Mounting on epoxy FR4 by using copper-filled through holes for heat transfer
CLP200M
SUBSTRATES AND MOUNTING INFORMA-
TION
The use of epoxy FR4 boards is quite common for
surface mounting techniques, however, their poor
thermal conduction compromises the
outstanding
PowerSO-10. Some methods to overcome this
limitation are discussed below.
One possibility to improve the thermal conduction
is the use of large heat spreader areas at the cop-
per layer of the PC board. This leads to a reduction
of thermal resistance to 35 °C for 6 cm
board heatsink (see fig. 2).
Use of copper-filled through holes on conventional
FR4 techniques will increase the metallization and
18/21
Fig 2 : Mounting on epoxy FR4 head dissipation by extending the area of the copper layer
thermal
performance
Copper foil
Copper foil
heatsink
otherwise
of
2
of the
the
decrease thermal resistance accordingly. Using
a configuration with 16 holes under the spreader of
the package with a pitch of 1.8 mm and a diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12°C/W (see fig. 3).
Beside the thermal advantage, this solution allows
multi-layer boards to be used. However, a draw-
back of this traditional material prevent its use in
very high power, high current circuits. For in-
stance, it is not advisable to surface mount devices
with currents greater than 10 A on FR4 boards. A
Power Mosfet or Schottky diode in a surface mount
power package can handle up to around 50 A if
better substrates are used.
heat transfer
FR4 board
FR4 board