ST10F269Z2Q6 STMicroelectronics, ST10F269Z2Q6 Datasheet - Page 139

MCU 16BIT 256K FLASH 144PQFP

ST10F269Z2Q6

Manufacturer Part Number
ST10F269Z2Q6
Description
MCU 16BIT 256K FLASH 144PQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheets

Specifications of ST10F269Z2Q6

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
Controller Family/series
ST10
No. Of I/o's
111
Ram Memory Size
12KB
Cpu Speed
40MHz
No. Of Timers
5
Embedded Interface Type
CAN, SSC, USART
Rohs Compliant
Yes
Processor Series
ST10F26x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN, SSC, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
2 x 16 bit
Operating Supply Voltage
0.3 V to 4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit x 10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-4833

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ST10F269
21 - ELECTRICAL CHARACTERISTICS
21.1 - Absolute Maximum Ratings
Note: 1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
21.2 - Parameter Interpretation
The parameters listed in the following tables represent the characteristics of the ST10F269 and its
demands on the system. Where the ST10F269 logic provides signals with their respective timing
characteristics, the symbol “CC” for Controller Characteristics, is included in the “Symbol” column.
Where the external system must provide signals with their respective timing characteristics to the
ST10F269, the symbol “SR” for System Requirement, is included in the “Symbol” column.
21.3 - DC Characteristics
V
f
CPU
DD
HYS
V
V
V
V
V
V
Symbol
V
Symbol
IHS
ILS
IH1
IH2
V
OL
IH
IL
V
I
T
V
AREF
P
I
TOV
= 5V ± 10%, V
T
= 32MHz with T
OV
DD
stg
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
During overload conditions (V
defined by the Absolute Maximum Ratings.
IO
tot
A
CC Output low voltage (PORT0, PORT1, Port 4,
SR Input low voltage
SR Input low voltage (special threshold)
SR
SR Input high voltage RSTIN
SR Input high voltage XTAL1
SR Input high voltage (special threshold)
Voltage on V
Voltage on any pin with respect to ground
Voltage on V
Input Current on any pin during overload condition
Absolute Sum of all input currents during overload condition
Power Dissipation
Ambient Temperature under bias
Storage Temperature
Input high voltage
(all except RSTIN and XTAL1)
Input Hysteresis (special threshold)
ALE, RD, WR, BHE, CLKOUT, RSTOUT)
SS
A
= 0V , Reset active, f
= -40 to + 125°C (TQFP144 devices)
AREF
DD
pins with respect to ground
IN
1
pin with respect to ground
> V
Parameter
1
DD
or V
Parameter
IN
< V
SS
CPU
) the voltage on pins with respect to ground (V
= 40MHz with T
1
1
1
3
1
1
21 - ELECTRICAL CHARACTERISTICS
I
Conditions
OL
A
= 2.4mA
Test
= -40 to + 125°C (PQFP144 devices) or
1
0.2 V
0.6 V
0.7 V
0.8 V
Min.
-0.5
-0.5
-0.2
250
0.9
-0.5, (V
-0.3, (V
DD
DD
DD
DD
-0.5, +6.5
-40, +125
-65, +150
SS
-10, +10
+
Value
|100|
) must not exceed the values
1.5
DD
DD
0.2 V
V
V
V
V
+0.5)
+0.3)
DD
DD
DD
DD
Max.
0.45
2.0
DD
+ 0.5
+ 0.5
+ 0.5
+ 0.5
-0.1
139/184
Unit
mA
mA
°C
°C
Unit
W
V
V
V
mV
V
V
V
V
V
V
V

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