ST10F269Z2Q6 STMicroelectronics, ST10F269Z2Q6 Datasheet - Page 115

MCU 16BIT 256K FLASH 144PQFP

ST10F269Z2Q6

Manufacturer Part Number
ST10F269Z2Q6
Description
MCU 16BIT 256K FLASH 144PQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheets

Specifications of ST10F269Z2Q6

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
Controller Family/series
ST10
No. Of I/o's
111
Ram Memory Size
12KB
Cpu Speed
40MHz
No. Of Timers
5
Embedded Interface Type
CAN, SSC, USART
Rohs Compliant
Yes
Processor Series
ST10F26x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN, SSC, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
2 x 16 bit
Operating Supply Voltage
0.3 V to 4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit x 10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-4833

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
201
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
745
Part Number:
ST10F269Z2Q6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
2
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
400
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
360
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
360
Part Number:
ST10F269Z2Q6
Manufacturer:
ST
Quantity:
20 000
ST10F269
Figure 55 : Asynchronous Reset Sequence Internal Fetch
Note: 1) RSTIN rising edge to internal latch of PORT0 is 3 CPU clock cycles (6 TCL) if the PLL is bypassed and the prescaler is on
Power-on reset
The asynchronous reset must be used during the
power-on of the MCU. Depending on the crystal
frequency, the on-chip oscillator needs about
10ms to 50ms to stabilize. The logic of the MCU
does not need a stabilized clock signal to detect
an asynchronous reset, so it is suitable for
power-on conditions. To ensure a proper reset
sequence, the RSTIN pin and the RPD pin must
be held at low level until the MCU clock signal is
stabilized and the system configuration value on
PORT0 is settled.
Hardware reset
The asynchronous reset must be used to recover
from catastrophic situations of the application. It
may be triggered by the hardware of the applica-
tion. Internal hardware logic and application cir-
cuitry are described in Section 18.6 - and
Figure 58, Figure 59 and Figure 60.
18.1.2 - Synchronous Reset (RSTIN pulse >
1040TCL and RPD pin at high level)
The synchronous reset is a warm reset. It may be
generated synchronously to the CPU clock. To be
detected by the reset logic, the RSTIN pulse must
be low at least for 4 TCL (2 periods of CPU clock).
2) 2.1µs typical value.
(f
CPU Clock
RSTIN
RPD
PORT0
PLL factor
latch command
Internal reset signal
Flash read signal
CPU
RSTOUT
= f
XTAL
/ 2), else it is 4 CPU clock cycles (8 TCL).
Reset Condition
Asynchronous
INTERNAL FETCH
Reset Configuration
6 or 8 TCL
1
Flash under reset for internal charge pump ramping up
2
3
1)
Latching point of PORT0
for PLL configuration
Then the I/O pins are set to high impedance and
RSTOUT pin is driven low. After the RSTIN level is
detected, a short duration of 12 TCL (6 CPU
clocks) maximum elapses, during which pending
internal hold states are cancelled and the current
internal access cycle, if any, is completed.
External bus cycle is aborted.
bit BDRSTEN of SYSCON register was previously
set by software. This bit is always cleared on
power-on or after any reset sequence.
The internal sequence lasts for 1024 TCL (512
periods of CPU clock). After this duration the
pull-down of RSTIN pin for the bidirectional reset
function is released and the RSTIN pin level is
sampled. At this step the sequence lasts 1040
TCL (4 TCL + 12 TCL + 1024 TCL). If the RSTIN
pin level is low, the reset sequence is extended
until RSTIN level becomes high. Refer to
Figure 56
Note
The internal pull-down of RSTIN pin is activated if
2.5µs max.
threshold (typically 2.5V for V
when RSTIN pin is low or when RSTIN pin
is internally pulled low, the ST10 reset
circuitry disables the bidirectional reset
function and RSTIN pin is no more pulled
If V
2)
RPD
voltage drops below the RPD pin
18 - SYSTEM RESET
Latching point of PORT0
for remaining bits
from Flash
1st fetch
DD
115/184
= 5V)

Related parts for ST10F269Z2Q6