ST10F269Z2Q3 STMicroelectronics, ST10F269Z2Q3 Datasheet - Page 163

IC FLASH MEM 256KBIT 144-PQFP

ST10F269Z2Q3

Manufacturer Part Number
ST10F269Z2Q3
Description
IC FLASH MEM 256KBIT 144-PQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of ST10F269Z2Q3

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-QFP
Processor Series
ST10F26x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
CAN, SSC, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
2 x 16 bit
Operating Supply Voltage
0.3 V to 4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit x 10 bit
Cpu Family
ST10
Device Core Size
16b
Frequency (max)
40MHz
Total Internal Ram Size
12KB
# I/os (max)
111
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Instruction Set Architecture
CISC/RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
144
Package Type
PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-2042

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST10F269Z2Q3
Manufacturer:
INFINEON
Quantity:
1 443
Part Number:
ST10F269Z2Q3
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST10F269Z2Q3
Manufacturer:
ST
Quantity:
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ST10F269
Notes: 1. RW-delay and
3. Partially tested, guaranteed by design characterization.
t
t
t
t
t
t
t
t
48
49
50
51
53
68
55
57
Symbol
2. Read data are latched with the same clock edge that triggers the address change and the rising RD edge. Therefore address
changes before the end of RD have no impact on read cycles.
CC
CC
CC
SR
SR
SR
CC
CC
RdCS, WrCS Low Time
(with RW-delay)
RdCS, WrCS Low Time
(no RW-delay)
Data valid to WrCS
Data hold after RdCS
Data float after RdCS
(with RW-delay)
Data float after RdCS
(no RW-delay)
Address hold after
RdCS, WrCS
Data hold after WrCS
t
A
refer to the next following bus cycle.
Parameter
3
3
36.875 + t
21.25 + t
17.25 + t
1.625 + t
Minimum
Maximum CPU Clock =
-10 + t
0
F
C
C
F
32MHz
C
Maximum
21.25 + t
0 + t
F
F
2TCL - 10 + t
3TCL - 10 + t
2TCL - 14 + t
TCL - 14 + t
Minimum
-10 + t
1/2 TCL = 1 to 32MHz
Variable CPU Clock
0
F
F
C
C
C
2TCL - 10 + t
TCL - 10 + t
Maximum
F
F
163/184
Unit
ns
ns
ns
ns
ns
ns
ns
ns

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