LPC3250FET296/01,5 NXP Semiconductors, LPC3250FET296/01,5 Datasheet - Page 42

• Manufacturer Part Number: LPC3250FET296/01,5
• Description: IC ARM9 MCU 256K 296-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC32x0r

Specifications of LPC3250FET296/01,5

• Package / Case: 296-TFBGA
• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
• Number Of I /o: 51
• Program Memory Type: ROMless
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC32
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: EMC
• Maximum Clock Frequency: 266 MHz
• Number Of Timers: 6
• Operating Supply Voltage: 1.31 V to 1.39 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
• Development Tools By Supplier: OM11016, OM11021, OM11045
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 3 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4962; 935290766551

NXP Semiconductors
9. Limiting values
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
LPC3220_30_40_50_1
Preliminary data sheet
Symbol
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(1V2)
DD(EMC)
DDA(3V3)
DD(IO)
IA
I
tot(pack)
esd
The following applies to
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Core, PLL, oscillator, and RTC supplies; applies to pins VDD_CORE, VDD_COREFXD, VDD_OSC, VDD_PLL397, VDD_PLLHCLK,
VDD_PLLUSB, VDD_RTC, VDD_RTCCORE, and VDD_RTCOSC.
I/O pad supply; applies to domains VDD_EMC and VDD_IOC.
Applies to VDD_AD pins.
Applies to pins in the following domains VDD_IOA, VDD_IOB, and VDD_IOD.
Including voltage on outputs in 3-state mode.
Based on package heat transfer, not device power consumption. Calculated package thermal resistance (Theta
JEDEC Test Board and 0 m/s airflow,
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Charge device model per AEC-Q100-011.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
otherwise noted.
Parameter
supply voltage (1.2 V)
external memory controller
supply voltage
analog supply voltage (3.3 V)
input/output supply voltage
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation
(per package)
electrostatic discharge voltage
Limiting values
Table
6:
15 % accuracy).
Conditions
1.8 V pins
3.3 V pins
per supply pin
per ground pin
max. junction temp 125 C
max. ambient temp 85 C
HBM
CDM
Rev. 01 — 6 February 2009
[1]
LPC3220/30/40/50
Notes Min
16/32-bit ARM microcontrollers
[2]
[3]
[4]
[5]
[6]
[6]
[7]
[8]
[9]
-
-
0.5
0.5
0.5
0.5
0.5
0.5
0.5
65
Max
+1.4
+4.6
+4.6
+4.6
+4.6
+2.4
+4.6
100
100
+150
1.12
+2000
+500
JA
© NXP B.V. 2009. All rights reserved.
): 35.766 C/W (with
SS
unless
Unit
V
V
V
V
V
V
V
mA
mA
W
V
V
C
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