PIC18F2320-I/SO Microchip Technology, PIC18F2320-I/SO Datasheet - Page 29

• Manufacturer Part Number: PIC18F2320-I/SO
• Description: IC MCU FLASH 4KX16 EEPROM 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2320-I/SO

• Core Size: 8-Bit
• Program Memory Size: 8KB (4K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 25
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 512Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SPI, I2C, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 2 x 8 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / Rohs Status: Details

5.4
To allow portability of code, a device programmer is
required to read the Configuration Word locations from
the hex file. If Configuration Word information is not
present in the hex file, then a simple warning message
should be issued. Similarly, while saving a hex file, all
Configuration Word information must be included. An
option to not include the Configuration Word informa-
tion may be provided. When embedding Configuration
Word information in the hex file, it should start at
address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
5.5
To allow portability of code, a device programmer is
required to read the data EEPROM information from
the hex file. If data EEPROM information is not present,
a simple warning message should be issued. Similarly,
when saving a hex file, all data EEPROM information
must be included. An option to not include the data
EEPROM information may be provided. When embed-
ding data EEPROM information in the hex file, it should
start at address F00000h.
Microchip Technology Inc. believes that this feature is
important for the benefit of the end customer.
 2010 Microchip Technology Inc.
Embedding Configuration Word
Information in the HEX File
Embedding Data EEPROM
Information in the HEX File
5.6
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The Configuration Word, appropriately masked
• ID locations
The Least Significant 16 bits of this sum are the
checksum.
Table 5-5 describes how to calculate the checksum for
each device.
Note:
PIC18FX220/X320
Checksum Computation
The checksum calculation differs depend-
ing on the code-protect setting. Since the
code memory locations read out differently
depending on the code-protect setting, the
table describes how to manipulate the
actual code memory values to simulate
the values that would be read from a
protected device. When calculating a
checksum by reading a device, the entire
code memory can simply be read and
summed. The Configuration Word and ID
locations can always be read.
DS39592F-page 29