IRF830AS Vishay, IRF830AS Datasheet

MOSFET N-CH 500V 5A D2PAK

IRF830AS

Manufacturer Part Number
IRF830AS
Description
MOSFET N-CH 500V 5A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRF830AS

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.4 Ohm @ 3A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
5A
Vgs(th) (max) @ Id
4.5V @ 250µA
Gate Charge (qg) @ Vgs
24nC @ 10V
Input Capacitance (ciss) @ Vds
620pF @ 25V
Power - Max
3.1W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF830AS
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
c. I
d. 1.6 mm from case.
e. Uses SiHF830A data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91062
S-81352-Rev. A, 16-Jun-08
(TO-262)
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Avalanche Current
Repetiitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
I
2
DS
DS(on)
g
gs
gd
SD
PAK
(Max.) (nC)
(nC)
(nC)
(V)
≤ 5.0 A, dI/dt ≤ 370 A/µs, V
(Max.) (Ω)
J
G
= 25 °C, L = 18 mH, R
D
S
G
a
a, e
(TO-263)
D
D
2
S
PAK
c, e
a
b, e
DD
V
GS
G
≤ V
D
IRF830ASPbF
SiHF830AS-E3
IRF830AS
SiHF830AS
= 25 Ω, I
= 10 V
2
PAK (TO-263)
DS
G
, T
IRF830AS, IRF830AL, SiHF830AS, SiHF830AL
Single
J
N-Channel MOSFET
500
≤ 150 °C.
6.3
24
11
AS
= 5.0 A (see fig. 12).
C
D
S
Power MOSFET
= 25 °C, unless otherwise noted
V
1.40
GS
at 10 V
T
T
for 10 s
A
C
= 25 °C
= 25 °C
T
T
C
C
D
IRF830ASTRLPbF
SiHF830ASTL-E3
IRF830ASTRL
SiHF830ASTL
= 100 °C
= 25 °C
2
FEATURES
• Low Gate Charge Q
• Improved Gate, Avalanche and Dynamic dV/dt
• Fully Characterized Capacitance and Avalanche Voltage
• Effective C
• Lead (Pb)-free Available
APPLICATIONS
• Switch Mode Power Supply (SMPS)
• Uninterruptible Power Supply
• High speed power switching
TYPICAL SMPS TOPOLOGIES
• Two Transistor Forward
• Half Bridge and Full Bridge
PAK (TO-263)
Requirement
Ruggedness
and Current
SYMBOL
a
a
T
dV/dt
oss
J
V
V
E
E
I
I
P
, T
a
I
DM
AR
DS
GS
AS
AR
D
a
D
stg
specified
g
Results in Simple Drive
- 55 to + 150
I
IRF830ALPbF
SiHF830AL-E3
IRF830AL
SiHF830AL
2
PAK (TO-262)
LIMIT
300
± 30
0.59
500
230
5.0
3.2
5.0
7.4
3.1
5.3
20
74
Vishay Siliconix
d
www.vishay.com
UNIT
W/°C
RoHS*
V/ns
COMPLIANT
mJ
mJ
°C
W
V
A
A
Available
1

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IRF830AS Summary of contents

Page 1

... 1.6 mm from case. e. Uses SiHF830A data and test conditions containing terminations are not RoHS compliant, exemptions may apply Document Number: 91062 S-81352-Rev. A, 16-Jun-08 IRF830AS, IRF830AL, SiHF830AS, SiHF830AL Power MOSFET FEATURES • Low Gate Charge Q 500 Requirement 1.40 • Improved Gate, Avalanche and Dynamic dV/dt ...

Page 2

... IRF830AS, IRF830AL, SiHF830AS, SiHF830AL Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient (PCB a Mounted, steady-state) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... Top 8 6.0 V 5.5 V 5.0 V Bottom 4 0 Drain-to-Source Voltage ( 91062_02 Fig Typical Output Characteristics Document Number: 91062 S-81352-Rev. A, 16-Jun-08 IRF830AS, IRF830AL, SiHF830AS, SiHF830AL 4 µs Pulse Width ° 91062_03 4 µs Pulse Width T = 150 ° 91062_04 Fig Normalized On-Resistance vs. Temperature Vishay Siliconix ...

Page 4

... IRF830AS, IRF830AL, SiHF830AS, SiHF830AL Vishay Siliconix MHz iss rss oss Drain-to-Source Voltage ( 91062_05 Fig Typical Capacitance vs. Drain-to-Source Voltage 5 250 100 Total Gate Charge (nC) 91062_06 G Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com Shorted iss C oss C rss 91062_07 Fig Typical Source-Drain Diode Forward Voltage ...

Page 5

... Single Pulse (Thermal Response 91062_11 Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case D.U. 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91062 S-81352-Rev. A, 16-Jun-08 IRF830AS, IRF830AL, SiHF830AS, SiHF830AL 125 150 - Rectangular Pulse Duration ( Driver + - Vishay Siliconix D.U.T. R ...

Page 6

... IRF830AS, IRF830AL, SiHF830AS, SiHF830AL Vishay Siliconix 500 400 300 200 100 100 Starting T , Junction Temperature (°C) 91062_12c J Fig. 12c - Maximum Avalanche Energy vs. Drain Current Charge Fig. 13a - Maximum Avalanche Energy vs. Drain Current www.vishay.com 6 790 I D Top 2.2 A 3.2 A Bottom 5.0 A 785 ...

Page 7

... Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91062. Document Number: 91062 S-81352-Rev. A, 16-Jun-08 IRF830AS, IRF830AL, SiHF830AS, SiHF830AL Peak Diode Recovery dV/dt Test Circuit + Circuit layout considerations • Low stray inductance • ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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