C2012X7R2A104K TDK Corporation, C2012X7R2A104K Datasheet - Page 24

CAP CER .10UF 100V X7R 10% 0805

C2012X7R2A104K

Manufacturer Part Number
C2012X7R2A104K
Description
CAP CER .10UF 100V X7R 10% 0805
Manufacturer
TDK Corporation
Series
Cr

Specifications of C2012X7R2A104K

Capacitance
0.1µF
Package / Case
0805 (2012 Metric)
Voltage - Rated
100V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
1.25mm
Tolerance (+ Or -)
10%
Voltage
100VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
2mm
Product Depth (mm)
1.25mm
Product Height (mm)
1.25mm
Product Diameter (mm)
Not Requiredmm
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Voltage Rating
100VDC
Capacitor Case Style
0805
No. Of Pins
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Compliant
Other names
445-1418-2
C2012X7R2A104KT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C2012X7R2A104K
Manufacturer:
RENESAS
Quantity:
101
Part Number:
C2012X7R2A104KT
Manufacturer:
TDK
Quantity:
460 000
Part Number:
C2012X7R2A104KT0L0U
Manufacturer:
TDK/东电化
Quantity:
20 000
Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — Mid Voltage Application // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.35 - 0.45
[CC0603]
[CC0402]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C1005
C3216
Chip capacitor
A
[CC0805]
[CC0603]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1608
C3225
Solder land
[CC1206]
[CC0805]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
Unit: mm
C2012
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C5750
C Series — Mid Voltage Application
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling

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