C2012X7R2A104K TDK Corporation, C2012X7R2A104K Datasheet - Page 24

• Manufacturer Part Number: C2012X7R2A104K
• Description: CAP CER .10UF 100V X7R 10% 0805
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C2012X7R2A104K

• Capacitance: 0.1µF
• Package / Case: 0805 (2012 Metric)
• Voltage - Rated: 100V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.25mm
• Tolerance (+ Or -): 10%
• Voltage: 100VDC
• Temp Coeff (dielectric): X7R
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 1.25mm
• Product Diameter (mm): Not Requiredmm
• Dielectric Characteristic: X7R
• Capacitance Tolerance: ± 10%
• Voltage Rating: 100VDC
• Capacitor Case Style: 0805
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 445-1418-2; C2012X7R2A104KT

Wave Soldering
Symbol
Reflow Soldering
Symbol
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — Mid Voltage Application // Version A11
A
B
C
A
B
C
A
B
C
Type
Type
Type
Soldering
Information
C
B
0.35 - 0.45
[CC0603]
[CC0402]
[CC1206]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
0.3 - 0.5
0.4 - 0.6
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
C1608
C1005
C3216
Chip capacitor
A
[CC0805]
[CC0603]
[CC1210]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
C2012
C1608
C3225
Solder land
[CC1206]
[CC0805]
[CC1812]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C3216
Unit: mm
C2012
C4532
Maximum amount
Minimum amount
Solder resist
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Unit: mm
C5750
C Series — Mid Voltage Application
Peak
Temp
• Recommended Soldering Profile
Solder
0
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free
Soldering
soldering
soldering
soldering
Manual
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Over 60 sec.
Reflow
Solder
Solder
Sn-Pb
Preheating
Wave
△T
Wave Soldering
Temp./
Dura.
Peak Temp time
Soldering
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C1005(CC0402), C1608(CC0603),
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Peak temp
250 max.
260 max.
300
0
(°C)
Wave Soldering
Over 60 sec.
Natural
cooling
Case Size - JIS (EIA)
∆T
Manual soldering
Preheating
(Solder iron)
Duration
3 max.
5 max.
(sec.)
3sec. (As short as possible)
Peak
Temp
0
Over 60 sec.
∆T
Peak temp
230 max.
260 max.
Preheating
Reflow Soldering
(°C)
Reflow Soldering
Peak Temp time
Soldering Natural
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Duration
20 max.
10 max.
(sec.)
cooling