OM11024 NXP Semiconductors, OM11024 Datasheet - Page 2

• Manufacturer Part Number: OM11024
• Description: KIT EVAL FOR LPC313X
• Manufacturer: NXP Semiconductors
• Type: Microcontrollerr

Specifications of OM11024

• Contents: 2 Boards, cable and software
• For Use With/related Products: LPC3131
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4719

NXP Semiconductors
3. Ordering information
Table 1.
Table 2.
LPC3130_3131
Preliminary data sheet
Type number
LPC3130FET180 TFBGA180 plastic thin fine pitch ball grid array package, 180 balls, body 12 × 12 × 0.8 mm SOT570-3
LPC3131FET180 TFBGA180 plastic thin fine pitch ball grid array package, 180 balls, body 12 × 12 × 0.8 mm SOT570-3
Type number
LPC3130FET180
LPC3131FET180
Ordering information
Ordering options for LPC3130/3131
Package
Name
Core/bus
frequency
180 MHz/
90 MHz
180 MHz/
90 MHz
Operating voltage and temperature
TFBGA180 package: 12 × 12 mm
Four 32-bit timers
Watchdog timer
PWM module
Random Number Generator (RNG)
General Purpose I/O (GPIO) pins
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Core voltage: 1.2 V
I/O voltage: 1.8 V, 3.3 V
Temperature: −40 °C to +85 °C
Description
Total
SRAM
96 kB
192 kB Device/
All information provided in this document is subject to legal disclaimers.
High-speed
USB
Device/
Host/OTG
Host/OTG
Rev. 1.04 — 27 May 2010
Low-cost, low-power ARM926EJ-S microcontrollers
10-bit
ADC
channels
4
4
2
, 0.8 mm pitch
I
I
2 each
2 each
2
2
S-bus/
C-bus
LPC3130/3131
MCI SDHC/
SDIO/
CE-ATA
yes
yes
© NXP B.V. 2010. All rights reserved.
Temperature
range
−40 °C to +85 °C
−40 °C to +85 °C
Version
2 of 72