AD9460-105LVDS/PCB Analog Devices Inc, AD9460-105LVDS/PCB Datasheet - Page 7

• Manufacturer Part Number: AD9460-105LVDS/PCB
• Description: BOARD EVAL FOR AD9460-105
• Manufacturer: Analog Devices Inc

Specifications of AD9460-105LVDS/PCB

• Number Of Adc's: 1
• Number Of Bits: 16
• Sampling Rate (per Second): 105M
• Data Interface: Parallel
• Inputs Per Adc: 1 Differential
• Input Range: *
• Power (typ) @ Conditions: 1.9W @ 105MSPS
• Voltage Supply Source: Single
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9460-105
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
ENVIRONMENTAL
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
AVDD1 to AGND
AVDD2 to AGND
DRVDD to DGND
AGND to DGND
AVDD1 to DRVDD
AVDD2 to DRVDD
AVDD2 to AVDD1
D0± Through D15± to DGND
CLK+/CLK− to AGND
OUTPUT MODE, DCS MODE, and
VIN+, VIN− to AGND
VREF to AGND
SENSE to AGND
REFT, REFB to AGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
DFS to AGND
Rating
−0.3 V to +4 V
−0.3 V to +6 V
−0.3 V to +4 V
−0.3 V to +0.3 V
−4 V to +4 V
−4 V to +6 V
−4 V to +6 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD1 + 0.3 V
−0.3 V to AVDD1 + 0.3 V
−0.3 V to AVDD2 + 0.3 V
−0.3 V to AVDD1 + 0.3 V
−0.3 V to AVDD1 + 0.3 V
−0.3 V to AVDD1 + 0.3 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. 0 | Page 7 of 32
THERMAL RESISTANCE
The heat sink of the AD9460 package must be soldered to
ground.
Airflow increases heat dissipation, effectively reducing θ
more metal directly in contact with the package leads from
metal traces through holes, ground, and power planes reduces
the θ
the ground plane.
Table 6.
Package Type
100-Lead TQFP_EP
1
2
3
Typical θ
Typical θ
Typical θ
resistance through heat sink path
JA
. It is required that the exposed heat sink be soldered to
JA
JB
JC
= 8.3°C/W (heat sink soldered) for a multilayer board in still air.
= 2°C/W (junction to exposed heat sink) represents the thermal
= 19.8°C/W (heat sink soldered) for a multilayer board in still air.
θ
19.8
JA
1
θ
8.3
JB
2
θ
2
JC
3
AD9460
Unit
°C/W
JA
. Also,