AD8220-EVALZ Analog Devices Inc, AD8220-EVALZ Datasheet - Page 8

• Manufacturer Part Number: AD8220-EVALZ
• Description: BOARD EVAL FOR AD8220ARMZ
• Manufacturer: Analog Devices Inc

Specifications of AD8220-EVALZ

• Design Resources: Fully Isolated Input Module Based on AD7793, ADuM5401, and a High Performance In-Amp (CN0067)
• Channels Per Ic: 1 - Single
• Amplifier Type: Instrumentation
• Output Type: Single-Ended, Rail-to-Rail
• Slew Rate: 2 V/µs
• -3db Bandwidth: 1.5MHz
• Current - Output / Channel: 15mA
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (main Ic): 750µA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 36 V, ±2.25 V ~ 18 V
• Board Type: Fully Populated
• Utilized Ic / Part: AD8220
• Silicon Manufacturer: Analog Devices
• Application Sub Type: JFET Input Instrumentation Amplifier
• Kit Application Type: Amplifier
• Silicon Core Number: AD8220
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AD8220-EVAL; AD8220-EVAL

AD8220
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Output Short-Circuit Current
Input Voltage (Common Mode)
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
θ
Package Glass Transition Temperature
ESD (Human Body Model)
ESD (Charge Device Model)
ESD (Machine Model)
1
2
Assumes the load is referenced to midsupply.
Temperature for specified performance is −40°C to +85°C. For performance
to 125°C, see the Typical Performance Characteristics section.
JA
(4-Layer JEDEC Standard Board)
2
Rating
±18 V
See Figure 3
Indefinite
±Vs
±Vs
−65°C to +125°C
−40°C to +125°C
300°C
140°C
135°C/W
140°C
4 kV
1 kV
0.4 kV
1
Rev. B | Page 8 of 28
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the MSOP on a 4-layer
JEDEC standard board. θ
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
–40
–20
0
AMBIENT TEMPERATURE (°C)
JA
values are approximations.
20
40
60
80
100
120