AD9748ACP-PCB Analog Devices Inc, AD9748ACP-PCB Datasheet - Page 6

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AD9748ACP-PCB

Manufacturer Part Number
AD9748ACP-PCB
Description
BOARD EVAL FOR AD9748ACP
Manufacturer
Analog Devices Inc
Series
TxDAC®r
Datasheet

Specifications of AD9748ACP-PCB

Rohs Status
RoHS non-compliant
Number Of Dac's
1
Number Of Bits
8
Outputs And Type
1, Differential
Sampling Rate (per Second)
210M
Data Interface
Parallel
Settling Time
11ns
Dac Type
Current
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9748
AD9748
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD
DVDD
CLKVDD
ACOM
ACOM
DCOM
AVDD
AVDD
DVDD
CLK+, CLK−, SLEEP
Digital Inputs, MODE
IOUTA, IOUTB
REFIO, FS ADJ
CLK+, CLK−, MODE
Junction Temperature
Storage Temperature
Lead Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may effect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Range
(10 sec)
With
Respect
to
ACOM
DCOM
CLKCOM
DCOM
CLKCOM
CLKCOM
DVDD
CLKVDD
CLKVDD
DCOM
DCOM
ACOM
ACOM
CLKCOM
Min
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−3.9
−3.9
−3.9
−0.3
−0.3
−1.0
−0.3
−0.3
−65
Max
+3.9
+3.9
+3.9
+0.3
+0.3
+0.3
+3.9
+3.9
+3.9
DVDD + 0.3
DVDD + 0.3
AVDD + 0.3
AVDD + 0.3
CLKVDD + 0.3
150
+150
300
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
Rev. A | Page 6 of 24
THERMAL CHARACTERISTICS
Thermal Resistance
32-Lead LFCSP
1
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
θ
JA
= 32.5°C/W
1

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