AD8310-EVAL Analog Devices Inc, AD8310-EVAL Datasheet - Page 22

• Manufacturer Part Number: AD8310-EVAL
• Description: BOARD EVAL FOR AD8310
• Manufacturer: Analog Devices Inc

Specifications of AD8310-EVAL

• Rohs Status: RoHS non-compliant

AD8310
DIE INFORMATION
Table 7. Die Pad Function Descriptions
Pin No.
1
2
3
4
5A, 5B
6
7
8
Mnemonic
INLO
COMM
OFLT
VOUT
VPOS
BFIN
ENBL
INHI
Description
One of Two Balanced Inputs. Biased roughly to VPOS/2.
Common Pin. Usually grounded.
Offset Filter Access. Nominally at about 1.75 V.
Low Impedance Output Voltage. Carries a 25 mA maximum load.
Positive Supply. 2.7 V to 5.5 V at 8 mA quiescent current.
Buffer Input. Used to lower postdetection bandwidth.
CMOS Compatible Chip Enable. Active when high.
Second of Two Balanced Inputs. Biased roughly to VPOS/2.
BOND PAD STATISTICS
ALL MEASUREMENTS IN MICRONS
MINIMUM PASSIVATION OPENING: 92 × 92, MINIMUM PAD PITCH: 150
DIE SIZE CALCULATION
ALL MEASUREMENTS IN MICRONS
DIE X (WIDTH OF DIE IN X DIRECTION) = 745
DIE Y (WIDTH OF DIE IN Y DIRECTION) = 1390
DIE THICKNESS = 305
COORDINATES OF BOND PAD CENTERS:
(1) –233, +540 (2) –250, +310
(4) –250, –519 (5B) +250, –366 (5A) +250, –516
(6) +250, –218 (7) +249, +310
2
3
4
1
X
Figure 43. Die Outline Dimensions
Rev. F | Page 22 of 24
8
5B
5A
7
6
(3) –250, –273
(8) +233, +540
Y