MPC8323E-MDS-PB Freescale Semiconductor, MPC8323E-MDS-PB Datasheet - Page 49

• Manufacturer Part Number: MPC8323E-MDS-PB
• Description: BOARD MODULE DEV SYSTEM 8323
• Manufacturer: Freescale Semiconductor
• Type: MPUr

Specifications of MPC8323E-MDS-PB

• Contents: Board
• For Use With/related Products: MPC8323
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see
MPC8323E PBGA,”
information on the PBGA.
21.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516
PBGA.
21.2
Figure 42
516-PBGA package.
Freescale Semiconductor
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8323E PBGA
Mechanical Dimensions of the MPC8323E PBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
and
Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,”
516
1.00 mm
2.25 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.6 mm
27 mm × 27 mm
Section 21.1, “Package Parameters for the
Package and Pin Listings
for
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