TWR-MCF51CN Freescale Semiconductor, TWR-MCF51CN Datasheet - Page 35
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TWR-MCF51CN
Manufacturer Part Number
TWR-MCF51CN
Description
KIT TOWER BOARD
Manufacturer
Freescale Semiconductor
Series
ColdFire®, Flexis™r
Type
MCUr
Specifications of TWR-MCF51CN
Contents
Board
Product
Microcontroller Modules
Data Bus Width
8 bit, 16 bit, 32 bit
Core Processor
MCF51CN128
Operating Supply Voltage
1.8 V to 3.6 V
Silicon Manufacturer
Freescale
Core Architecture
Coldfire
Core Sub-architecture
Coldfire V1
Silicon Core Number
MCF51
Silicon Family Name
MCF51CN
Rohs Compliant
Yes
For Use With/related Products
Freescale Tower System, MCF51CN128
For Use With
TWR-ELEV - TOWER ELEVATOR BOARDS HARDWARE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3.12.5
This section provides details about program/erase times and program-erase endurance for the flash memory.
Program and erase operations do not require any special power sources other than the normal V
information about program/erase operations, see the Memory section of the MCF51CN128 Reference Manual.
3.13
Electromagnetic compatibility (EMC) performance is highly dependent on the environment in which the MCU resides. Board
design and layout, circuit topology choices, location and characteristics of external components as well as MCU software
operation all play a significant role in EMC performance. The system designer should consult Freescale applications notes such
as AN2321, AN1050, AN1263, AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC
performance.
Freescale Semiconductor
1
2
3
4
5
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied
for calculating approximate time to program and erase.
The program and erase currents are additional to the standard run I
with V
Typical endurance for flash was evaluated for this product family on the HC9S12Dx64. For additional information on
how Freescale defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile
Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and
de-rated to 25 °C using the Arrhenius equation. For additional information on how Freescale defines typical data retention,
refer to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
C
D
D
D
D
P
P
P
P
D
D
C
C
DD
Supply voltage for program/erase
-40 °C to 85 °C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Longword program time (random location)
Longword program time (burst mode)
Page erase time
Mass erase time
Longword program current
Page erase current
Program/erase endurance
Data retention
EMC Performance
T
T = 25°C
Flash Specifications
= 3.3 V, bus frequency = 8.0 MHz.
L
to T
H
= –40°C to + 85°C
5
Characteristic
2
(2)
3
MCF51CN128 ColdFire Microcontroller Data Sheet, Rev. 4
1
4
3
Table 22. Flash Characteristics
(2)
(2)
V
Symbol
prog/erase
R
R
V
f
t
t
t
t
t
t
FCLK
IDDBP
IDDPE
D_ret
Burst
Page
Mass
Fcyc
Read
prog
DD
10,000
. These values are measured at room temperatures
Min
150
1.8
1.8
—
—
—
15
5
100,000
Typical
20,000
4000
100
9.7
7.6
—
—
—
—
—
9
4
DD
supply. For more detailed
Electrical Characteristics
Max
6.67
200
3.6
3.6
—
—
—
—
—
cycles
years
t
t
t
t
Unit
kHz
mA
mA
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
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