ADSP-3PARCBF548E02 Analog Devices Inc, ADSP-3PARCBF548E02 Datasheet - Page 98

• Manufacturer Part Number: ADSP-3PARCBF548E02
• Description: KIT DEV STARTER BF548
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: DSPr

Specifications of ADSP-3PARCBF548E02

• Contents: Board, Cables, CD, Headset with Microphone, Module, Power Supply
• For Use With/related Products: ADSP-BF548
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-BF542/ADSP-BF544/ADSP-BF547/ADSP-BF548/ADSP-BF549
OUTLINE DIMENSIONS
Dimensions for the 17 mm × 17 mm CSP_BGA package in
Figure 87
SURFACE-MOUNT DESIGN
Table 67
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 67. BGA Data for Use with Surface-Mount Design
Package
400-Ball CSP_BGA (Chip Scale Package Ball Grid Array) BC-400-1 Solder Mask Defined
1.70 MAX
is provided as an aid to PCB design. For industry-stan-
are shown in millimeters.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,
3. CENTER DIMENSIONS ARE NOMINAL.
WITH THE EXCEPTION OF BALL DIAMETER.
A1 BALL INDICATOR
Figure 87. 400-Ball, 17 mm
SIDE VIEW
17.00 BSC SQ
TOP VIEW
DETAIL A
Rev. C | Page 98 of 100 | February 2010
×
17 mm CSP_BGA (Chip Scale Package Ball Grid Array) (BC-400-1)
Package
Ball Attach Type
BALL DIAMETER
M
W
A
B
C
D
E
G
H
K
N
P
R
U
V
Y
F
J
L
T
0.12 MAX
COPLANARITY
20 19 18 17
0.50
0.45
0.40
0.80 BSC BALL PITCH
16
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Package
Solder Mask Opening
0.40 mm Diameter
15.20 BSC SQ
BOTTOM VIEW
DETAIL A
SEATING PLANE
0.28 MIN
Package
Ball Pad Size
0.50 mm Diameter
A1 BALL