DC-ME-9210-NET Digi International, DC-ME-9210-NET Datasheet - Page 43

• Manufacturer Part Number: DC-ME-9210-NET
• Description: KIT JUMP START ME 9210 NET+OS 7
• Manufacturer: Digi International
• Series: Digi Connect ME®r
• Type: MCU Moduler

Specifications of DC-ME-9210-NET

• Contents: Board, Cables, CD, Digi JTAG Link Hardware Debugger, Documentation, Module, Power Supply
• Data Rate: 10 Mbps to 100 Mbps
• Memory Type: SDRAM
• Interface Type: RS-232, Ethernet
• Operating Voltage: 12 V
• Operating Current: 346 mA
• Maximum Power Dissipation: 825 mW
• Operating Temperature Range: - 40 C to + 80 C
• Board Size: 36.7 mm x 19.05 mm
• Data Bus Width: 32 bit
• Modulation: CCK, DBPSK, DQPSK
• Product: Modules
• Security: 64/128 bit WEP, TKIP, WPA, WPA2
• Silicon Manufacturer: Digi Intl
• Kit Application Type: Communication & Networking
• Application Sub Type: Embedded
• Silicon Family Name: Digi Connect ME
• Rohs Compliant: Yes
• For Use With/related Products: Digi Connect ME 9210 Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 602-1136

Additional Design Recommendations
Mechanical
43
interface connector
Dimensions
Device/serial
      
Weight
Length
Height
Width
The following list provides additional design guidance with respect to thermal management
in applications with operating temperatures at the high end or beyond the specified standard
ambient temperature range.

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Providing air movement will improve heat dissipation.
The host PCB plays a large part in dissipating the heat generated by the module.
A large copper plane located under the Digi Connect ME 9210 and soldered to
the module’s mounting tabs will improve the heat dissipation capabilities of the
PCB.
If the design allows, added buried PCB planes will also improve heat
dissipation. The copper planes create a larger surface to spread the heat into the
surrounding environment.
Adding a thermal pad or thermal compound, such as Sil-Pad
Gap Filler products made by the Bergquest Company
(www.bergquistcompany.com), between the host PCB and the underside of the
module will significantly increase the thermal transfer between the module’s
enclosure and the host PCB. Limit the fill area to the folded metal portion of the
module’s underside.
P/N FTS-110-01-F-DV-TR or similar). Positions 3 through 6 are removed.
20-pin micro header (10-pin double row) with .05-inch (1.27-mm) pitch (Samtec
Digi Connect
(36.703 mm)
1.445 in.
17.463g
.616oz.
ME
0.854 in. (21.69 mm)
0.75 in. (19.05 mm)
19.731 g.
.696 oz.
Digi Connect
Total - 1.104 oz.
(46.99 mm)
Wi-ME
31.298 g
1.85 in
®
, Gap Pad
Antenna- .408 oz.
11.567 g
®
or