AG003-01E NVE, AG003-01E Datasheet - Page 69
![ASSEMBLY CURRENT SENSOR EVAL](/photos/9/20/92012/ag003-01e_sml.jpg)
AG003-01E
Manufacturer Part Number
AG003-01E
Description
ASSEMBLY CURRENT SENSOR EVAL
Manufacturer
NVE
Specifications of AG003-01E
Sensor Type
Magnetic. GMR (Giant Magnetoresistive)
Interface
Analog
Embedded
No
Utilized Ic / Part
AA Series Current Sensors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Other names
391-1060
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Notes:
1.
2.
Package:
Please see the package drawing section in the Appendix for dimensions of the TDFN6 package.
Pin Configuration
Note: The die attach pad is exposed on the back of this package. NVE recommends that it be connected to
the ground pin and the PCB for improved temperature performance.
No Connect
Vreg (Out)
VCC (In)
Power dissipation rating for TDFN6 package in free air is 320°C/Watt. Soldering the package to a PCB, including the die
attach paddle, improves temperature performance substantially. The input voltage and output current are limited by thermal
power dissipation at the package.
Due to package size, TDFN6 package has a three-letter code to designate part type.
DC001-10,
DC002-10
www.nve.com
No Connect
No Connect
phone: 952-829-9217 fax: 952-829-9189
Ground
Peripheral Integrated Circuits
- 69 -
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