CYII4SC014K-EVAL Cypress Semiconductor Corp, CYII4SC014K-EVAL Datasheet - Page 26

• Manufacturer Part Number: CYII4SC014K-EVAL
• Description: BOARD EVAL IMAG SENS IBIS4-14000
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYII4SC014K-EVAL

• Sensor Type: CMOS Imaging, Color (RGB)
• Sensing Range: 14 Megapixel
• Interface: SPI
• Sensitivity: 3 fps
• Voltage - Supply: 3.3V
• Embedded: No
• Utilized Ic / Part: IBIS4-14000
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Information on lead free soldering
CYII4SM014KAA-GEC: The product is tested successfully for
Pb-free soldering processes using a reflow temperature profile
with maximum 260°C, minimum 40s at 255°C and minimum 90s
at 217°C.
CYII4SC014KAA-GTC: The product will not withstand a Pb-free
soldering process. Maximum allowed reflow or wave soldering
temperature is 220°C. Hand soldering is recommended for this
part type.
Note “Intentional content” is defined as any material demanding
special attention is contained into the inquired product by
following cases:
Defect Specification
A document called “IBIS4-14000 Defect Specification” is available on request. This documents contains the criteria against which the
IBIS4-14000 is tested before being shipped. Contact Cypress for more information ([e-mail]).
Document #: 38-05709 Rev. *D
The following case is not treated as “intentional content”:
1. A case that the above material is added as a chemical com-
2. A case that the above material, which is used intentionally in
1. A case that the above material is contained as an impurity into
position into the inquired product intentionally in order to pro-
duce and maintain the required performance and function of
the intended product .
the manufacturing process, is contained in or adhered to the
inquired product
raw materials or parts of the intended product. The impurity is
defined as a substance that cannot be removed industrially,
or it is produced at a process such as chemical composing or
reaction and it cannot be removed technically.
CYII4SM014KAA-GEC
CYII4SC014KAA-GTC
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