TMPSNS-RTD1 Microchip Technology, TMPSNS-RTD1 Datasheet - Page 29
![BOARD EVAL PT100 RTD TEMP SENSOR](/photos/9/17/91791/tmpsns-rtd1_sml.jpg)
TMPSNS-RTD1
Manufacturer Part Number
TMPSNS-RTD1
Description
BOARD EVAL PT100 RTD TEMP SENSOR
Manufacturer
Microchip Technology
Datasheets
1.MCP3301-CIMS.pdf
(32 pages)
2.PCM18XR1.pdf
(438 pages)
3.MCP6S22DM-PICTL.pdf
(43 pages)
4.TMPSNS-RTD1.pdf
(26 pages)
Specifications of TMPSNS-RTD1
Sensor Type
Temperature
Interface
USB
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP3301, MCP6S26, PIC18F2550
Processor To Be Evaluated
MCP6S26, MCP3301, MCP6024, MCP41010, PIC18F2550, TC1071, MCP6002
Data Bus Width
12 bit
Interface Type
USB
Lead Free Status / RoHS Status
Not applicable / Not applicable
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2007 Microchip Technology Inc.
Device:
Grade:
Temperature Range:
Package:
PART NO.
Device
Grade
X
MCP3301:
MCP3301T: 13-Bit Serial A/D Converter (Tape and Reel)
B
C
I
MS = Plastic MSOP, 8-lead
P
SN = Plastic SOIC (150 mil Body), 8-lead
= ±1 LSB INL
= ±2 LSB INL
= -40°C to +85°C
= Plastic DIP (300 mil Body), 8-lead
Temperature
Range
X
13-Bit Serial A/D Converter
Package
/XX
Examples:
a)
b)
c)
MCP3301-BI/P: ±1 LSB INL, Industrial
Temperature, PDIP package
MCP3301-BI/SN: ±1 LSB INL, Industrial
Temperature, SOIC package
MCP3301-CI/MS: ±2 LSB INL, Industrial
Temperature, MSOP package
MCP3301
DS21700C-page29