TMPSNS-RTD1 Microchip Technology, TMPSNS-RTD1 Datasheet - Page 14
![BOARD EVAL PT100 RTD TEMP SENSOR](/photos/9/17/91791/tmpsns-rtd1_sml.jpg)
TMPSNS-RTD1
Manufacturer Part Number
TMPSNS-RTD1
Description
BOARD EVAL PT100 RTD TEMP SENSOR
Manufacturer
Microchip Technology
Datasheets
1.MCP3301-CIMS.pdf
(32 pages)
2.PCM18XR1.pdf
(438 pages)
3.MCP6S22DM-PICTL.pdf
(43 pages)
4.TMPSNS-RTD1.pdf
(26 pages)
Specifications of TMPSNS-RTD1
Sensor Type
Temperature
Interface
USB
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP3301, MCP6S26, PIC18F2550
Processor To Be Evaluated
MCP6S26, MCP3301, MCP6024, MCP41010, PIC18F2550, TC1071, MCP6002
Data Bus Width
12 bit
Interface Type
USB
Lead Free Status / RoHS Status
Not applicable / Not applicable
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
MCP3301
4.0
The descriptions of the pins are listed in Table 4-1.
TABLE 4-1:
4.1
This input pin provides the reference voltage for the
device, which determines the maximum range of the
analog input signal and the LSB size.
The LSB size is determined by the equation shown
below. As the reference input is reduced, the LSB size
is reduced accordingly.
EQUATION
When using an external voltage reference device, the
system designer should always refer to the manufac-
turer’s recommendations for circuit layout. Any instabil-
ity in the operation of the reference device will have a
direct effect on the accuracy of the ADC conversion
results.
4.2
Positive analog input. This pin has an absolute voltage
range of V
range is defined as the absolute value of (IN+) - (IN-).
4.3
Negative analog input. This pin has an absolute voltage
range of V
range is defined as the absolute value of (IN+) - (IN-).
4.4
Ground connection to internal circuitry. If an analog
ground plane is available, it is recommended that this
device be tied to the analog ground plane in the circuit.
See Section 6.6, “Layout Considerations”, for more
information regarding circuit layout.
DS21700C-page 14
V
IN(+)
IN(-)
V
CS/SHDN
D
CLK
V
REF
SS
DD
OUT
Name
PIN DESCRIPTIONS
Voltage Reference (V
IN(+)
IN(-)
V
SS
SS
SS
-0.3V to V
-0.3V to V
Reference Voltage Input
Positive Analog Input
Negative Analog Input
Ground
Chip Select / Shutdown Input
Serial Data Out
Serial Clock
+2.7V to 5.5V Power Supply
LSB Size =
PIN FUNCTION TABLE.
DD
DD
+0.3V. The full scale input
+0.3V. The full scale input
2 x V
Function
8192
REF
REF
)
4.5
The CS/SHDN pin is used to initiate communication
with the device when pulled low. This pin will end a con-
version and put the device in low power standby when
pulled high. The CS/SHDN pin must be pulled high
between conversions and cannot be tied low for multi-
ple conversions. See Figure 7-2 for serial communica-
tion protocol.
4.6
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place. See Figure 7-2 for serial communication
protocol.
4.7
The SPI clock pin is used to initiate a conversion as well
as to clock out each bit of the conversion as it takes
place. See Section 6.2 for constraints on clock speed
and Figure 7-2 for serial communication protocol.
4.8
The voltage on this pin can range from 2.7 to 5.5V. To
ensure accuracy, a 0.1 µF ceramic bypass capacitor
should be placed as close as possible to the pin. See
Section 6.6 for more information regarding circuit
layout.
Chip Select/Shutdown (CS/SHDN)
Serial Data Output (D
Serial Clock (CLK)
V
DD
© 2007 Microchip Technology Inc.
OUT
)