LM2793LDEV National Semiconductor, LM2793LDEV Datasheet - Page 9

• Manufacturer Part Number: LM2793LDEV
• Description: BOARD EVALUATION LM2793LD
• Manufacturer: National Semiconductor
• Series: PowerWise®r

Specifications of LM2793LDEV

• Current - Output / Channel: 16mA
• Outputs And Type: 2, Non-Isolated
• Voltage - Output: 4 V
• Features: Charge Pump
• Voltage - Input: 2.7 ~ 5.5V
• Utilized Ic / Part: LM2793
• Lead Free Status / RoHS Status: Not applicable / Not applicable

Application Information
The junction temperature rating takes precedence over the
ambient temperature rating. The LM2793 may be operated
outside the ambient temperature rating, so long as the junc-
tion temperature of the device does not exceed the maxi-
mum operating rating of 100˚C. The maximum ambient tem-
perature rating must be derated in applications where high
power dissipation and/or poor thermal resistance causes the
junction temperature to exceed 100˚C.
PCB Layout Considerations
The LLP is a leadframe based Chip Scale Package (CSP)
with very good thermal properties. This package has an
exposed DAP (die attach pad) at the center of the package
= 85˚C + (0.149W x 55˚C/W)
T
J
= T
A
+ (P
= 93˚C
DMAX
x θ
JA
)
(Continued)
9
measuring 2.0mm x 1.2mm. The main advantage of this
exposed DAP is to offer lower thermal resistance when it is
soldered to the thermal land on the PCB. For PCB layout,
National highly recommends a 1:1 ratio between the pack-
age and the PCB thermal land. To further enhance thermal
conductivity, the PCB thermal land may include vias to a
ground plane. For more detailed instructions on mounting
LLP packages, please refer to National Semiconductor Ap-
plication Note AN-1187.
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