HI5741-EVS Intersil, HI5741-EVS Datasheet - Page 3

• Manufacturer Part Number: HI5741-EVS
• Description: EVALUATION PLATFORM HI5741
• Manufacturer: Intersil

Specifications of HI5741-EVS

• Number Of Dac's: 1
• Number Of Bits: 14
• Outputs And Type: 1, Differential
• Sampling Rate (per Second): 100M
• Data Interface: Parallel
• Settling Time: 20ns
• Dac Type: Current
• Voltage Supply Source: Analog and Digital, Dual ±
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: HI5741
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum ratings
Digital Supply Voltage V
Negative Digital Supply Voltage DV
Negative Analog Supply Voltage AV
Digital Input Voltages (D13-D0, CLK) to DGND. . . . . DV
Internal Reference Output Current. . . . . . . . . . . . . . . . . . . . ±2.5mA
Voltage from CTRL AMP IN to AV
Control Amplifier Output Current . . . . . . . . . . . . . . . . . . . . . ±2.5mA
Reference Input Voltage Range. . . . . . . . . . . . . . . . . -3.7V to AV
Analog Output Current (I
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
SYSTEM PERFORMANCE
Resolution
Integral Linearity Error, INL
(Note 5)
Differential Linearity Error, DNL
Offset Error, I
Full Scale Gain Error, FSE
Full Scale Gain Drift
Offset Drift Coefficient
Full Scale Output Current, I
Output Voltage Compliance Range
DYNAMIC CHARACTERISTICS
Throughput Rate
Output Voltage Settling Time
(
Singlet Glitch Area, GE (Peak)
Output Slew Rate
Output Rise Time
Output Fall Time
Spurious Free Dynamic Range within a Window
(Note 4)
1. θ
1
/
16
JA
th Scale Step Across Segment)
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
OS
PARAMETER
CC
OUT
to DGND . . . . . . . . . . . . . . . . . . . +5.5V
FS
) . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
3
EE
EE
AV
T
EE
. . . . . . . . . . . . . . . . 2.5V to 0V
A
T
EE
to DGND . . . . . . . . . . -5.5V
= +25°C
A
to AGND, ARTN . . . . -5.5V
= +25°C
, DV
EE
= -4.94V to -5.46V, V
“Best Fit Straight Line”, T
“Best Fit Straight Line”, T
(Note 5) T
(Note 5)
(Notes 3, 5)
With Internal Reference
(Note 4)
(Note 4)
(Note 4)
R
R
R
R
R
R
f
f
f
f
f
f
CLK
CLK
CLK
CLK
CLK
CLK
L
L
L
L
L
L
CC
= 64Ω (Note 4) - Settling to 0.024%
= 64Ω (Note 4) - Settling to 0.012%
= 64Ω (Note 4)
= 64Ω, DAC Operating in Latched Mode (Note 4)
= 64Ω, DAC Operating in Latched Mode (Note 4)
= 64Ω, DAC Operating in Latched Mode (Note 4)
= 10 MSPS, f
= 20 MSPS, f
= 40 MSPS, f
= 50 MSPS, f
= 80 MSPS, f
= 100 MSPS, f
to -0.5V
A
EE
= +25°C
HI5741
TEST CONDITIONS
CC
OUT
OUT
OUT
OUT
OUT
OUT
= +4.75 to +5.25V, V
= 1.23MHz, 2MHz Span
= 5.055MHz, 2MHz Span
= 16MHz, 10MHz Span
= 10.1MHz, 2MHz Span
= 5.1MHz, 2MHz Span
= 10.1MHz, 2MHz Span
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature
Maximum Storage Temperature Range . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
A
A
= +25°C
= -40°C to +85°C
HI5741BIx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
(SOIC - Lead Tips Only)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
REF
= Internal,
-1.75
-1.25
T
MIN
-1.5
-1.0
100
14
A
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
= -40°C TO +85°C
HI5741BI
-20.48
1,000
±150
TYP
±1.0
±0.5
675
470
3.2
11
20
87
77
75
80
78
79
8
1
-
-
-
-
-
MAX
1.75
0.05
1.5
1.0
September 20, 2006
75
10
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
θ
JA
FSR/°C
FN4071.12
UNITS
MSPS
µA/°C
pV•s
V/µs
(°C/W)
70
LSB
LSB
LSB
ppm
dBc
dBc
Bits
dBc
dBc
dBc
dBc
mA
µA
ns
ns
ps
ps
%
V