NCP360GEVB ON Semiconductor, NCP360GEVB Datasheet - Page 13

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NCP360GEVB

Manufacturer Part Number
NCP360GEVB
Description
EVAL BOARD FOR NCP360G
Manufacturer
ON Semiconductor
Datasheets

Specifications of NCP360GEVB

Design Resources
NCP360 Eval Brd BOM NCP360GEVB Gerber Files NCP360 Eval Brd Schematic
Main Purpose
Overvoltage Protection
Embedded
No
Utilized Ic / Part
NCP360
Primary Attributes
Overvoltage Protection up to 20V
Secondary Attributes
Overvoltage Lockout (OVLO), Undervoltage Lockout (UVLO)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
NCP360G
Other names
NCP360GEVBOS
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
T
S
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
D
SEATING
PLANE
5X
0.20
C A B
0.039
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
1.0
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
J
CASE 483−02
K
ISSUE H
TSOP−5
DETAIL Z
13
0.074
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
J
K
L
S
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_
NCP360/D

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