NCP360GEVB ON Semiconductor, NCP360GEVB Datasheet - Page 10

• Manufacturer Part Number: NCP360GEVB
• Description: EVAL BOARD FOR NCP360G
• Manufacturer: ON Semiconductor

Specifications of NCP360GEVB

• Design Resources: NCP360 Eval Brd BOM NCP360GEVB Gerber Files NCP360 Eval Brd Schematic
• Main Purpose: Overvoltage Protection
• Embedded: No
• Utilized Ic / Part: NCP360
• Primary Attributes: Overvoltage Protection up to 20V
• Secondary Attributes: Overvoltage Lockout (OVLO), Undervoltage Lockout (UVLO)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP360G
• Other names: NCP360GEVBOS

measurement on final application board to make sure of the
final Thermal Resistance.
In every case, we recommend to make thermal
Figure 20. Thermal Resistance of UDFN 2x2 and TSOP Packages as a Function of PCB Area and Thickness
380
330
280
230
180
130
80
0
100
200
Copper heat spreader area (mm^2)
http://onsemi.com
300
10
400
TSOP−5 1.0 oz
TSOP−5 2.0 oz
DFN 2x2.2 1.0 oz
DFN 2x2.2 2.0 oz
% Delta DFN vs TSOP−5
500
600
700
50%
45%
40%
35%
30%
25%
20%
15%
10%
5%
0%