CY3275 Cypress Semiconductor Corp, CY3275 Datasheet - Page 6

KIT DEV POWERLINE PROGRAM

CY3275

Manufacturer Part Number
CY3275
Description
KIT DEV POWERLINE PROGRAM
Manufacturer
Cypress Semiconductor Corp
Type
Other Power Managementr
Datasheets

Specifications of CY3275

Main Purpose
Interface, Transceiver, Powerline Communication
Embedded
No
Utilized Ic / Part
CY8CPLC20
Primary Attributes
2400bps Data Transfer Over Low Voltage Power Lines
Secondary Attributes
User Configurable LEDs
Board Size
101.6 mm x 101.6 mm
Interface Type
RS-232, Ethernet, I2C, ISSP
Maximum Operating Temperature
+ 40 C
Operating Supply Voltage
12 V, 24 V
Product
Power Management Development Tools
Dimensions
101.6 mm x 101.6 mm
Silicon Manufacturer
Cypress
Silicon Core Number
CY8CPLC20
Kit Application Type
Communication & Networking
Application Sub Type
Low Voltage Powerline Communication
Rohs Compliant
Yes
For Use With/related Products
CY8CPLC20
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-3005
Introduction
6
The Cypress PLC solution consists of three key elements as shown in
Figure 1-1. Cypress PLC Solution Block Diagram
The powerline network protocol layer and the physical layer FSK modem are implemented on the
CY8CPLC20 chip. The chip also contains a PSoC core in addition to the PLC core. The power
amplification and coupling circuits are built using discrete components.
The network protocol layer allows for the addressing of multiple nodes on the network. This enables
point-to-multipoint communication. The protocol layer also provides a defined packet structure for
transmitting data packets from one node to the other as well as error detection and packet retransmit
functionalities.
A two node system level diagram is shown in
Powerline network protocol layer
Physical layer FSK modem
Power Amplification And Coupling Circuits
CY3275 Cypress Low Voltage Programmable PLC Development Kit Guide, Doc. # 001-53657 Rev. *B
Figure
1-2.
Figure
1-1.
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