MCP212XDM Microchip Technology, MCP212XDM Datasheet - Page 37

• Manufacturer Part Number: MCP212XDM
• Description: BOARD DEVELOPMENT IRDA
• Manufacturer: Microchip Technology

Specifications of MCP212XDM

• Main Purpose: Interface, IrDA
• Utilized Ic / Part: MCP2120, MCP2122
• Silicon Manufacturer: Microchip
• Silicon Core Number: MCP2120, MCP2122
• Core Architecture: PIC
• Core Sub-architecture: PIC18
• Kit Contents: MCP2120/22 Developers Board, Important Information Read First
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Embedded: -
• Primary Attributes: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

A.1
© 2009 Microchip Technology Inc.
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some schematics and
board layouts may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2120/22
Developer’s Board:
• Board - Schematic
• Board - Top Silk and Pads
• Board - Top layer plus Silk and Pads
• Board - Bottom Layer
• Board - V
• Board - Ground Layer
The layer order is shown in Figure A-1.
FIGURE A-1:
Appendix A. Schematic and Layouts
DD
NOTICE TO CUSTOMERS
Layer
MCP2120/22 DEVELOPER’S BOARD
LAYER ORDER
Top Layer
Ground Layer
Power Layer
Bottom Layer
USER’S GUIDE
DS51842A-page 33