PCA4988 Renesas Electronics America, PCA4988 Datasheet - Page 131

• Manufacturer Part Number: PCA4988
• Description: DEV 80D0 TO 40-PIN DIL STD PITCH
• Manufacturer: Renesas Electronics America

Specifications of PCA4988

• Module/board Type: Converter Board
• For Use With/related Products: PC4701
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Appendix I
Technical Term
CUBE
Electrodes that can be mounted on the user system's foot pattern.
Cavity BGA
Cavity Ball Grid Array
DIP
Dual Inline Package
Fine pitch BGA
Fine pitch Ball Grid Array
Flip-clip BGA
Flip-clip Ball Grid Array
HQFP
Heat sinked Quad Flat Package
HSOP
Heat sinked Small Outline Package
*All brand names and product names are trademarks or registered trademarks of their respective companies.
Example:
Coding Conventions of IC Package
16P 2 N – A
Rev.1.00 2004.06 Page 131 of 135
Number of pins
However, if some leads are deleted or
integrated intentionally, this
not coincide with the actual number of pins.
The actual number of pins and this
number may not match.
Package structure
C : Transparent plastic type
D : Ceramic chip carrier type
F : Glass epoxy board type
K : Glass seal ceramic type
N : Glass epoxy board type (memory module)
P : Plastic type
S : Metal seal ceramic type
W : Tape carrier type
Package structure
1 : DIP(other than plastic type)
2 : SOP
3 : TSOP
4 : DIP(plastic type)
5 : SIP, ZIP
6 : QFP
7 : BGA
8 : PGA
9 : Special type
0 : QFJ, SOJ
F : TQFP
H : CSP
J : CSP
T : TSOP
Auxiliary symbol for external form (1)
This symbol is included as necessary
to identify the main body size or lead pitch.
There are no general common rules for
this symbol.
Auxiliary symbol for external form (2)
This symbol is included as necessary
to identify the lead shape such as lead bend.
There are no general common rules for
this symbol.
figure may