AXA005A0X Lineage Power, AXA005A0X Datasheet - Page 15

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AXA005A0X

Manufacturer Part Number
AXA005A0X
Description
CONVERT DC/DC 0.75 5.5V @ 5A SIP
Manufacturer
Lineage Power
Series
Austin MicroLynx™r
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet

Specifications of AXA005A0X

Rohs Status
RoHS non-compliant
Output
0.75 ~ 5.5V
Number Of Outputs
1
Power (watts)
27W
Mounting Type
Through Hole
Voltage - Input
10 ~ 14V
Package / Case
5-SIP Module
1st Output
0.75 ~ 5.5 VDC @ 5A
Size / Dimension
0.90" L x 0.26" W x 0.40" H (22.9mm x 6.6mm x 10.2mm)
Power (watts) - Rated
27.5W
Operating Temperature
-40°C ~ 85°C
Efficiency
89%
Approvals
CSA, EN, UL, VDE
Product
Non-Isolated / POL
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
No RoHS Version Available
Other names
555-1009

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Manufacturer
Quantity
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Data Sheet
October 1, 2009
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-
up is shown in Figure 32. Note that the airflow is
parallel to the long axis of the module as shown in
figure 31. The derating data applies to airflow in
either direction of the module’s long axis.
Figure 31. T ref Temperature measurement
location.
The thermal reference point, T
specifications of thermal derating curves is shown in
Figure 31. For reliable operation this temperature
should not exceed 125
The output power of the module should not exceed
the rated power of the module (Vo,set x Io,max).
LINEAGE
Thermal Considerations
Top View
POWER
Bottom View
o
C.
Air Flow
T
ref1
ref 1
(inductor winding)
used in the
10 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 5A output current
T
Austin MicroLynx
ref2
Wind Tunnel
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Figure 32. Thermal Test Set-up.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by various module versus local ambient
temperature (T
1m/s (200 ft./min) are shown in the Characteristics
Curves section.
Layout Considerations
Copper paths must not be routed beneath the power
module. For additional layout guide-lines, refer to
FLTR100V10 application note.
TM
12V SIP Non-isolated Power Modules:
PWBs
A
) for natural convection and up to
flow
Air
(0.285)
x
7.24_
(3.0)
76.2_
25.4_
(1.0)
Probe Location
for measuring
airflow and
ambient
temperature
Power Module
15

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