LTM4602HVIV#PBF Linear Technology, LTM4602HVIV#PBF Datasheet - Page 16

• Manufacturer Part Number: LTM4602HVIV#PBF
• Description: IC DC/DC UMODULE 6A 104-LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM4602HVIV#PBF

• Design Resources: LTM4602HV Spice Model
• Output: 0.6 ~ 5 V
• Number Of Outputs: 1
• Power (watts): 30W
• Mounting Type: Surface Mount
• Voltage - Input: 4.5 ~ 28 V
• Package / Case: 104-LGA
• 1st Output: 0.6 ~ 5 VDC @ 6A
• Size / Dimension: 0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
• Power (watts) - Rated: 30W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 92%
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -

APPLICATIO S I FOR ATIO
Layout Checklist/Example
The high integration of the LTM4602HV makes the PCB
board layout very simple and easy. However, to optimize
its electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current path, in-
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath
• To minimize the via conduction loss and reduce module
LTM4602HV
Table 3. 1.5V Output
16
cluding V
PCB conduction loss and thermal stress
tors next to the V
high frequency noise
the unit
thermal stress, use multiple vias for interconnection
between top layer and other power layers
AIR FLOW (LFM)
7
4
3
6
5
2
1
0
50
Figure 17. 12V to 3.3V (950kHz),
BGA Heatsink
200
400
200
400
0
0
0LFM
200LFM
400LFM
60
IN
, PGND and V
TEMPERATURE (°C)
70
U
IN
, PGND and V
80
BGA Heatsink
BGA Heatsink
BGA Heatsink
HEATSINK
U
None
None
None
OUT
90
4602HV F16
. It helps to minimize the
100
W
OUT
pins to minimize
Figure 18. 24V to 3.3V, No Heatsink
θ
7
4
3
6
5
2
1
0
50
JA
10.25
15.2
13.9
11.3
(°C/W)
14
12
U
0LFM
200LFM
400LFM
60
TEMPERATURE (°C)
70
Table 4. 3.3V Output
• Do not put via directly on pad
• Use a separated SGND ground copper area for com-
Figure 20 gives a good example of the recommended
layout.
LTM4602 Frequency Adjustment
The LTM4602HV is designed to typically operate at 850kHz
across most input and output conditions. The control ar-
chitecture is constant on time valley mode current control.
The f
optional 1000pF capacitor. The switching frequency has
been optimized to maintain constant output ripple over the
operating conditions. The equations for setting the operat-
ing frequency are set around a programmable constant
on time. This on time is developed by a programmable
80
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit
AIR FLOW (LFM)
ADJ
90
200
400
200
400
0
0
4602HV F18
pin is typically left open or decoupled with an
100
7
6
5
4
3
2
1
0
BGA Heatsink
BGA Heatsink
BGA Heatsink
50
Figure 19. 24V to 3.3V, BGA Heatsink
HEATSINK
None
None
None
0LFM
200LFM
400LFM
60
TEMPERATURE (°C)
70
80
θ
JA
15.2
14.6
13.4
13.9
11.1
10.5
(°C/W)
90
4602HV F19
4602hvf
100