APA501-60-003 Emerson Network Power, APA501-60-003 Datasheet - Page 3

• Manufacturer Part Number: APA501-60-003
• Description: HEATSINK (60)57.5X59X22.5MM VERT
• Manufacturer: Emerson Network Power

Specifications of APA501-60-003

• Accessory Type: Heat Sink
• Heatsink Material: Aluminum
• For Use With/related Products: AMPSS®
• Lead Free Status / Rohs Status: No

Heatsinks
Heatsinks for AMPSS modules are available in a
variety of sizes and fin orientation. Mounting kits
and thermal pads are also available. The table
below shows the options available for "80" and "60"
module sizes.
A heatsink mounting kit provides the most conven-
ient way to mount the heatsink to the module and
then mount the assembly onto a circuit board
Description
Heatsink, "60" size, vertical fin.
Heatsink, "60" size, horizontal fin
Heatsink, "60" size, vertical fin.
Heatsink, "60" size, horizontal fin
Heatsink, "60" size, vertical fin.
Heatsink, "60" size, horizontal fin
Heatsink, "60" size, low profile
Heatsink, "80" size, vertical fin.
Heatsink, "80" size, horizontal fin
Heatsink, "80" size, vertical fin.
Heatsink, "80" size, horizontal fin
Heatsink, "80" size, vertical fin.
Heatsink, "80" size, horizontal fin
Heatsink, "80" size, low profile
Thermal Pad, "60" size
Thermal Pad, "80" size
Mounting Kit, Tapped Studs
Mounting Kit, Solder Studs
Mounting Kit, Tapped Studs
for low profile heatsink
Mounting Kit, Solder Studs
for low profile heatsink
Spring Sockets (20 cont. 15pwr)
Rev. 01 Jan 96
1
Model Number
APA501-60-001
APA501-60-002
APA501-60-003
APA501-60-004
APA501-60-005
APA501-60-006
APA501-60-007
APA501-80-001
APA501-80-002
APA501-80-003
APA501-80-004
APA501-80-005
APA501-80-006
APA501-80-007
APA502-60-001
APA502-80-001
APA503-00-001
APA503-00-002
APA503-00-007
APA503-00-008
APA504-00-001
AMPSS modules may be retained by their input and
output pins only, or may be fixed to the board using
bolts screwed into the tapped studs which are
provided as part of the mounting kit. In both cases
the studs provide clearance between the module and
the circuit board to facilitate PCB cleaning opera-
tions.
Note: baseplate and heatsink must be connected to
protective earth
2.26x2.32x0.6 57.5x59x15
2.26x2.32x0.6 57.5x59x15
2.26x2.32x0.9 57.5x59x22.5
2.26x2.32x0.9 57.5x59x22.5
2.26x2.32x1.5 57.5x59x37
2.26x2.32x1.5 57.5x59x37
2.25x3.50x0.5 57.2x89x12
4.53x2.32x0.6 115x59x15
4.53x2.32x0.6 115x59x15
4.53x2.32x0.9 115x59x22.5
4.53x2.32x0.9 115x59x22.5
4.53x2.32x1.5 115x59x37
4.53x2.32x1.5 115x59x37
4.55x3.50x0.5 115.6x89x12
2
inches
Dimensions
AMPSS
mm
®
Reference Manual
Free air thermal
resistance
3.8˚C/W
3.9˚C/W
3.3˚C/W
3.7˚C/W
2.8˚C/W
2.8˚C/W
3.6˚C/W
2.7˚C/W
2.4˚C/W
2.2˚C/W
2.0˚C/W
2.0˚C/W
1.7˚C/W
2.2˚C/W
3