LA E67F-AABA-24-3A4B-Z OSRAM Opto Semiconductors Inc, LA E67F-AABA-24-3A4B-Z Datasheet - Page 11

LED TOPLED 617NM AMBER 4PLCC

LA E67F-AABA-24-3A4B-Z

Manufacturer Part Number
LA E67F-AABA-24-3A4B-Z
Description
LED TOPLED 617NM AMBER 4PLCC
Manufacturer
OSRAM Opto Semiconductors Inc
Series
TOPLEDr
Type
Uni-Colorr

Specifications of LA E67F-AABA-24-3A4B-Z

Package / Case
4-PLCC
Viewing Angle
120°
Color
Amber
Luminous Flux @ Current - Test
4.88 lm
Millicandela Rating
1680mcd
Current - Test
50mA
Wavelength - Dominant
617nm
Wavelength - Peak
624nm
Voltage - Forward (vf) Typ
2.15V
Lens Type
Clear
Lens Style/size
Round, 2.4mm
Size / Dimension
3.20mm L x 2.80mm W
Height
2.10mm
Mounting Type
Surface Mount
Resistance Tolerance
617nm
Led Size
3.4 mm x 3 mm
Illumination Color
Amber
Operating Voltage
2.15 V
Wavelength
617 nm
Luminous Intensity
1120 mcd
Mounting Style
SMD/SMT
Operating Current
70 mA
Lens Shape
Round
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Peak Wavelength
624 nm
Package Type
PLCC
Emitting Color
Red Orange
Test Current (it)
50mA
Forward Current
70mA
Dominant Wave Length
617nm
Luminous Flux
5lm
Forward Voltage
2.65V
Product Length (mm)
3mm
Product Height (mm)
2mm
Product Depth (mm)
3.4mm
Mounting
Surface Mount
Shape Type
Circular
Chip Material
AlGaInP
Main Category
Chip LED
Number Of Elements
1
Pin Count
4
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 100C
Reverse Voltage
12V
Lens Dimensions
2.4x2.4x0.9mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
Q65110A7380
Lötbedingungen
Soldering Conditions
IR-Reflow Lötprofil für bleifreies Löten
IR Reflow Soldering Profile for lead free soldering
Wellenlöten (TTW)
TTW Soldering
2005-06-01
T
300
250
200
150
100
T
50
˚C
0
300
250
200
150
100
50
0
C
0
0
255 ˚C
240 ˚C
217 ˚C
25 ˚C
235 C
100
Ramp Up
3 K/s (max)
C
... 260
... 130
50
C
C
ca 200 K/s
1. Welle
1. wave
50
2 K/s
120 s max
100
10 s
Recommended Solder Profile
Zwangskühlung
forced cooling
5 K/s
Maximum Solder Profile
Minimum Solder Profile
100
(nach CECC 00802)
(acc. to CECC 00802)
11
2. Welle
2. wave
150
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020B)
(acc. to J-STD-020B)
2 K/s
150
200
100 s max
30 s max
t
Normalkurve
standard curve
Grenzkurven
limit curves
200
Ramp Down
6 K/s (max)
10 s min
t
250
260 ˚C
245 ˚C
235 ˚C
s
OHLY0598
OHLA0687
s
+0 ˚C
-5 ˚C
+5 ˚C
-0 ˚C
±5 ˚C
250
LA E67F
300

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