HLMP-D105 Avago Technologies US Inc., HLMP-D105 Datasheet - Page 8

• Manufacturer Part Number: HLMP-D105
• Description: LED 5MM 645NM RED WATER CLEAR
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-D105

• Viewing Angle: 24°
• Package / Case: Radial - 2 Lead
• Color: Red
• Millicandela Rating: 240mcd
• Current - Test: 20mA
• Wavelength - Dominant: 637nm
• Wavelength - Peak: 645nm
• Voltage - Forward (vf) Typ: 1.8V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 8.81mm
• Mounting Type: Through Hole
• Resistance Tolerance: 637nm
• Led Size: T-1 3/4
• Illumination Color: Red
• Lens Color/style: Untinted Non-Diffused
• Operating Voltage: 1.8 V
• Wavelength: 637 nm
• Luminous Intensity: 240 mcd
• Operating Current: 20 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: Through Hole
• Color, Emitted: Red
• Color, Lens: Clear
• Current Rating: 30 mA (DC)
• Current, Forward: 20 mA
• Package Type: 5 mm (T-13⁄4)
• Temperature, Operating, Maximum: 100 °C
• Temperature, Operating, Minimum: -20 °C
• Voltage, Reverse: 5 V
• Wavelength, Peak: 645 nm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1344

Example of Wave Soldering Temperature Profile for TH LED
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-0230EN - December 17, 2010
250
200
150
100
50
0
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
50
60
70
LAMINAR
www.avagotech.com
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.