LS E63B-BBCB-1-1-Z OSRAM Opto Semiconductors Inc, LS E63B-BBCB-1-1-Z Datasheet - Page 11

• Manufacturer Part Number: LS E63B-BBCB-1-1-Z
• Description: LED SUP RED 633NM CLR 4-PLCC SMD
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: TOPLEDr
• Type: Uni-Colorr

Specifications of LS E63B-BBCB-1-1-Z

• Package / Case: 4-PLCC
• Viewing Angle: 30°
• Color: Red
• Luminous Flux @ Current - Test: 1.7 lm
• Millicandela Rating: 3370mcd
• Current - Test: 50mA
• Wavelength - Dominant: 633nm
• Wavelength - Peak: 645nm
• Voltage - Forward (vf) Typ: 2.2V
• Lens Type: Clear
• Lens Style/size: Round, 2.6mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 3.80mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 633nm
• Led Size: 2.6 mm X 2.6 mm X 1.7 mm
• Illumination Color: Red
• Operating Voltage: 2.5 V
• Wavelength: 633 nm
• Luminous Intensity: 2525 mcd (Max)
• Mounting Style: SMD/SMT
• Operating Current: 70 mA
• Lens Shape: Circular
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Peak Wavelength: 645 nm
• Package Type: PLCC
• Emitting Color: Red
• Test Current (it): 50mA
• Forward Current: 70mA
• Dominant Wave Length: 633nm
• Luminous Flux: 1.7lm
• Forward Voltage: 2.5V
• Product Length (mm): 3mm
• Product Height (mm): 3.7mm
• Product Depth (mm): 3.4mm
• Mounting: Surface Mount
• Shape Type: Circular
• Chip Material: AlGaInP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 4
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 12V
• Power Dissipation: 180mW
• Lens Dimensions: 2.6x2.6x1.7mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 475-1191-2; Q65110A2336

Empfohlenes Lötpaddesign verwendbar für TOPLED und Power TOPLED
Reflow Löten
Recommended Solder Pad useable for TOPLED and Power TOPLED
Reflow Soldering
Empfohlenes Lötpaddesign
Recommended Solder Pad
2010-09-01
8) Seite 16
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) page 16
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
8) page 16
6.1 (0.240)
8) Seite 16
0.8 (0.031)
2.8 (0.110)
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
3.3 (0.130)
Lötstoplack
Solder resist
Wellenlöten (TTW)
TTW Soldering
11
Anode
LS E63B, LA E63B, LO E63B, LY E63B
2.8 (0.110)
Cu Fläche / 16 mm per pad
Cu-area
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.5 (0.020)
<
_
2
Cu Fläche / > 16 mm per pad
Cu-area
Kathode/
Cathode
Lötstoplack
Solder resist
Kathode/
Cathode
OHLPY440
2
OHAY1583