LH T674-M2P1-1-Z OSRAM Opto Semiconductors Inc, LH T674-M2P1-1-Z Datasheet - Page 10

• Manufacturer Part Number: LH T674-M2P1-1-Z
• Description: LED TOPLED RED 645NM CLR 2-PLCC
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: TOPLEDr
• Type: Uni-Colorr

Specifications of LH T674-M2P1-1-Z

• Package / Case: 2-PLCC
• Viewing Angle: 120°
• Color: Red
• Luminous Flux @ Current - Test: 110 mlm
• Millicandela Rating: 39.2mcd
• Current - Test: 10mA
• Wavelength - Dominant: 645nm
• Wavelength - Peak: 660nm
• Voltage - Forward (vf) Typ: 1.75V
• Lens Type: Clear
• Lens Style/size: Round, 2.4mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 2.10mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 645nm
• Led Size: 3.2 mm x 2.8 mm
• Illumination Color: Hyper Red
• Lens Color/style: Colorless Non-Diffused
• Operating Voltage: 1.75 V
• Wavelength: 645 nm
• Mounting Style: SMD/SMT
• Operating Current: 10 mA
• Lens Shape: Flat Round
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Peak Wavelength: 660 nm
• Package Type: PLCC
• Emitting Color: Red
• Luminous Intensity: 56mcd
• Test Current (it): 10mA
• Forward Current: 30mA
• Dominant Wave Length: 645nm
• Luminous Flux: 0.11lm
• Forward Voltage: 2.5V
• Product Length (mm): 3.4mm
• Product Height (mm): 2mm
• Product Depth (mm): 3mm
• Mounting: Surface Mount
• Shape Type: Circular
• Chip Material: GaAlAs
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Power Dissipation: 90mW
• Lens Dimensions: 2.4x2.4x0.9mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 475-2703-2; Q65110A3597

Empfohlenes Lötpaddesign
Recommended Solder Pad
Empfohlenes Lötpaddesign verwendbar für TOPLED
IR Reflow Löten
Recommended Solder Pad useable for TOPLED
IR Reflow Soldering
2005-03-10
8) Seite 15
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) page 15
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
8) page 15
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) Seite 15
0.7 (0.028)
0.8 (0.031)
2.6 (0.102)
Anode
3.3 (0.130)
IR-Reflow Löten
IR Reflow Soldering
Lötstoplack
Solder resist
10
®
Lötstopplack
Solder resist
and Power TOPLED
®
Cu Fläche / 16 mm per pad
Cu-area
2.6 (0.102)
und Power TOPLED
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
<
_
Cu-Fläche > 16 mm
Cu-area > 16 mm
2
OHLPY970
Kathode/
Cathode
2
®
2
®
OHLPY440
LH T674