HLMP-D150-C00B2 Avago Technologies US Inc., HLMP-D150-C00B2 Datasheet - Page 8

• Manufacturer Part Number: HLMP-D150-C00B2
• Description: LED 5MM LC ALGAAS RED DIFF 65DEG
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-D150-C00B2

• Viewing Angle: 65°
• Package / Case: Radial - 2 Lead
• Color: Red
• Voltage Rating: 1.6V
• Current: 1mA
• Lens Type: Diffused, Red Tinted
• Lens Style/size: Round, 5mm, T-1 3/4
• Configuration: Single
• Mounting Type: Through Hole, Right Angle
• Voltage - Forward (vf) Typ: 1.6V
• Millicandela Rating: 3mcd
• Luminous Flux @ Current - Test: 3 mlm
• Current - Test: 1mA
• Wavelength - Peak: 645nm
• Resistance Tolerance: 637nm
• Led Size: T-1 3/4
• Illumination Color: Red
• Lens Color/style: Tinted Diffused
• Operating Voltage: 1.6 V
• Wavelength: 637 nm
• Luminous Intensity: 3 mcd
• Operating Current: 20 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: Through Hole
• Bulb Size: T-1 3/4 (5mm)
• Led Color: Red
• Forward Current If: 1mA
• Forward Voltage: 1.6V
• Led Mounting: Through Hole
• Wavelength Typ: 637nm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1768; HLMP-D150-C00B2

Example of Wave Soldering Temperature Profile for TH LED
8
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
250
200
150
100
50
0
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
50
60
70
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.