HSMF-C118 Avago Technologies US Inc., HSMF-C118 Datasheet
HSMF-C118
Specifications of HSMF-C118
HSMF-C118
Available stocks
Related parts for HSMF-C118
HSMF-C118 Summary of contents
Page 1
... ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity. CAUTION: HSMF-C118 is Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Features • ...
Page 2
Package Dimensions LED DIE 3 4 3.2 (0.126 ) 2.0 (0.079) 0.6 (0.024) DIFFUSED EPOXY PC BOARD ANODE MARK 0.4 (0.016) 4 – 0.05 (0.002) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED. 2 ...
Page 3
Absolute Maximum Ratings 25°C A Parameter [ Forward Current [1] Power Dissipation [2] DC Forward Current [2] Power Dissipation Reverse Voltage (I = 100 µA) R LED Junction Temperature Operating Temperature Range Storage Temperature ...
Page 4
Intensity (I ) Bin Limits v Intensity (mcd) Bin ID Min. Max. L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 Tolerance: ± 15%. [1] Color Bin ...
Page 5
InGaN InGaN BLUE GREEN 80 AS RED 400 450 500 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength RED 15 GREEN, BLUE 10 ...
Page 6
USER FEED DIRECTION PRINTED LABEL Figure 9. Reeling orientation. 3.0 ± 0.5 (0.118 ± 0.020) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 10. Reel dimensions. CATHODE SIDE Ø 13.1 ± 0.5 (Ø 0.516 ...
Page 7
... USER FEED DIRECTION TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B PART NUMBER ± 0.10 (± 0.004) ± 0.10 (± 0.004) HSMF-C118 3.52 (0.139) 3.02 (0.119) START THERE SHALL BE A MINIMUM OF MINIMUM OF 160 mm 230 mm (6.3 INCH) OF EMPTY (9.05 INCH) COMPONENT POCKETS ...
Page 8
Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-100, Surface Mounting SMT LED Indicator Components. Storage Condition 30°C @ 0%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% ...