VSML3710-GS08 Vishay, VSML3710-GS08 Datasheet - Page 4

• Manufacturer Part Number: VSML3710-GS08
• Description: EMITTER IR PLCC-2 HI PWR 940NM
• Manufacturer: Vishay

Specifications of VSML3710-GS08

• Rise Time: 800 ns
• Radiant Intensity: 8 mW/sr
• Viewing Angle: 120°
• Current - Dc Forward (if): 100mA
• Radiant Intensity (ie) Min @ If: 4mW/sr @ 100mA
• Wavelength: 950nm
• Voltage - Forward (vf) Typ: 1.35V
• Orientation: Top View
• Mounting Type: Surface Mount
• Package / Case: PLCC-2
• Beam Angle: 60 deg
• Maximum Forward Current: 100 mA
• Maximum Power Dissipation: 170 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Fall Time: 800 ns
• Forward Current: 100 mA
• Forward Voltage: 1.35 V
• Lens Shape: Circular
• Mounting Style: SMD/SMT
• Peak Wavelength: 940nm
• Forward Current If(av): 100mA
• Fall Time Tf: 800ns
• Supply Voltage Range: 1.35V To 3V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1257-2

VSML3710
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
SOLDER PROFILE
www.vishay.com
4
Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
19841
Fig. 9 - Relative Radiant Power vs. Wavelength
14291
1.25
0.75
0.25
300
250
200
150
100
1.0
0.5
50
0
0
890
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
λ
100
Drawing-No.: 6.541-5067.01-4
Issue: 5; 04.11.08
20541
- Wavelength (nm)
Time (s)
I
F
C
= 100 mA
150
940
For technical questions, contact:
max. 100 s
max. 30 s
200
High Power Infrared Emitting Diode,
3
Pin identification
3.5
Ø 2.4
max. 260 °C
+ 0.15
± 0.2
250
245 °C
940 nm, GaAlAs/GaAs
300
990
A
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
1.6 (1.9)
Fig. 10 - Relative Radiant Intensity vs. Angular Displacement
94 8013
Mounting Pad Layout
1.0
0.9
0.8
0.7
technical drawings
according to DIN
specifications
amb
0.6
1.2
< 30 °C, RH < 60 %
0.4
4
area covered with
solder resist
0.2
0°
0
10°
Document Number: 81300
20°
Rev. 1.4, 03-Nov-09
30°
40°
50°
60°
70°
80°