AFBR-5205PZ Avago Technologies US Inc., AFBR-5205PZ Datasheet - Page 2

• Manufacturer Part Number: AFBR-5205PZ
• Description: TXRX ATM/SONET/OC-3 SC 1X9 MEZZ
• Manufacturer: Avago Technologies US Inc.

Specifications of AFBR-5205PZ

• Data Rate: 155Mbps
• Wavelength: 1310nm
• Applications: Ethernet
• Voltage - Supply: 4.75 V ~ 5.25 V
• Connector Type: SC
• Mounting Type: Through Hole
• Function: Provides the system designer with products to implement a range of soluntions for multimode fiber SONET OC-3 (SDH STM-1)
• Product: Transceiver
• Maximum Rise Time: 3 ns, 2.2 ns
• Maximum Fall Time: 3 ns, 2.2 ns
• Pulse Width Distortion: 0.04 ns, 1 ns
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 4.75 V to 5.25 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Package / Case: SIP-9
• For Use With: Multimode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Receiver Sections
The receiver sections of the
AFBR-5205Z series utilize InGaAs
PIN photodiodes coupled to a
custom silicon transimpedance
preamplifier IC. These are
packaged in the optical subassem-
bly portion of the receiver.
These PIN/preamplifier combina-
tions are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The data output is
differential. The signal detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL referenced
(shifted) to a +5 volt power
supply.
Package
The overall package concept for
the Avago transceivers consists of
three basic elements; the two
optical subassemblies, an
electrical subassembly, and the
housing as illustrated in the block
diagrams in Figure 1 and
Figure 1a.
The package outline drawing and
pin out are shown in Figures 2,
2a, and 3. The details of this
package outline and pin out are
compliant with the multisource
definition of the 1x9 SIP. The low
profile of the Avago transceiver
design complies with the
maximum height allowed for the
duplex SC connector over the
entire length of the package.
Figures 2b and 2c show the
outline drawings for options that
include mezzanine height and
extended and flush shields
respectively.
2
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board on which
the IC chips and various surface-
mounted passive circuit elements
are attached.
The package includes internal
shields for the electrical and
optical subassemblies to insure
low EMI emissions and high
immunity to external EMI fields.
The outer housing including the
duplex SC connector or the
duplex ST ports is molded of filled
non-conductive plastic to provide
mechanical strength and electrical
isolation. The solder posts of the
Avago design are isolated from
the circuit design of the
transceiver and do not require
connection to a ground plane on
the circuit board.
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
DIFFERENTIAL
DATA IN
Figure 1. SC block diagram.
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PREAMP IC
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the
transceiver by mating with the
duplex or simplex SC or ST
connectored fiber cables.
Note: The “T” in the product
numbers indicates a transceiver
with a duplex ST connector
receptacle. Product numbers
without a “T” indicate
transceivers with a duplex SC
connector receptacle.
Application Information
The Applications Engineering
group in the Avago Optical
Communication Division is
available to assist you with the
technical understanding and
design trade-offs associated with
these transceivers. You can con-
tact them through your Avago
sales representative.
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
LED