AFCT-5964NGZ Avago Technologies US Inc., AFCT-5964NGZ Datasheet - Page 9

• Manufacturer Part Number: AFCT-5964NGZ
• Description: TXRX OPT SM SONET OC3/SDH 2X10
• Manufacturer: Avago Technologies US Inc.
• Series: METRAKr

Specifications of AFCT-5964NGZ

• Applications: General Purpose
• Data Rate: 115Mbps
• Wavelength: 1300nm
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Data Rate Max: 0.155Gbps
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package footprint and front panel considerations
Avago Technologies transceivers comply with
the circuit board “Common Transceiver
Footprint” hole pattern defined in the current
multisource agreement which defined the 2 x
10 package style. This drawing is reproduced
in Figure 7 with the addition of ANSI Y14.5M
compliant dimensioning to be used as a guide
in the mechanical layout of your circuit board.
Figure 8 shows the front panel dimensions
associated with such a layout.
Eye Safety Circuit
For an optical transmitter device to be eye-
safe in the event of a single fault failure, the
transmitter must either maintain eye-safe
operation or be disabled.
The AFCT-5964TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ is
intrinsically eye safe and does not require shut
down circuitry.
Signal Detect
The Signal Detect circuit provides a de-asserted
output signal when the optical link is broken
(or when the remote transmitter is OFF). The
Signal Detect threshold is set to transition
from a high to low state between the minimum
receiver input optical power and -45 dBm avg.
input optical power indicating a definite optical
fault (e.g. unplugged connector for the receiver
or transmitter, broken fiber, or failed far-end
transmitter or data source). The Signal Detect
does not detect receiver data error or error-
Figure 7. Recommended Board Layout Hole Pattern
(0.299)
9
(0.525)
13.34
7.59
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
*4
(0.236)
(0.118)
6
3
(0.28)
7.11
(0.35)
8.89
(0.18)
4.57
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
9 x 1.78
(0.07)
(0.63)
16
(0.121)
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
20 x Ø 0.81 ±0.1
9.59
(0.032 ±0.004)
2 x Ø 2.29
(0.09)
rate. Data errors can be determined by signal
processing offered by upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost
concerns is the control of electromagnetic
emissions from electronic equipment. Success
in controlling generated Electromagnetic
Interference (EMI) enables the designer to pass
a governmental agency’s EMI regulatory standard
and more importantly, it reduces the possibility
of interference to neighboring equipment. Avago
Technologies has designed the AFCT-5964TLZ/
TGZ/ATLZ/ATGZ/NLZ/NGZ to provide excellent
EMI performance. The EMI performance of a
chassis is dependent on physical design and
features which help improve EMI suppression.
Avago Technologies encourages using standard
RF suppression practices and avoiding poorly
EMI-sealed enclosures.
Avago Technologies OC-3 LC transceivers (AFCT-
5964TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ) have nose
shields which provide a convenient chassis
connection to the nose of the transceiver. This
nose shield improves system EMI performance
by effectively closing off the LC aperture. The
recommended transceiver position, PCB layout
and panel opening for these devices are the
same, making them mechanically drop-in
compatible. Figure 8 shows the recommended
positioning of the transceivers with respect to
the PCB and faceplate.
(0.055 ±0.004)
4 x Ø 1.4 ±0.1
(0.079)
2
*5
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS
2. THE HATCHED AREAS ARE KEEP-OUT AREAS
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26
*4. THE MOUNTING STUDS SHOULD BE
*5. HOLES FOR OPTIONAL HOUSING LEADS
RECOMMENDED CIRCUIT BOARD LAYOUT
FOR THE SFF TRANSCEIVER.
RESERVED FOR HOUSING STANDOFFS. NO
METAL TRACES OR GROUND CONNECTION
IN KEEP-OUT AREAS.
PCB HOLES (20 I/O PINS, 2 SOLDER POSTS
AND 4 OPTIONAL PACKAGE GROUNDING
TABS). PACKAGE GROUNDING TABS
SHOULD BE CONNECTED TO SIGNAL
GROUND.
SOLDERED TO CHASSIS GROUND FOR
MECHANICAL INTEGRITY AND TO ENSURE
FOOTPRINT COMPATIBILITY WITH OTHER
SFF TRANSCEIVERS.
MUST BE TIED TO SIGNAL GROUND.
FIGURE
DESCRIBES
THE