HFBR-5963LZ Avago Technologies US Inc., HFBR-5963LZ Datasheet - Page 4

• Manufacturer Part Number: HFBR-5963LZ
• Description: TXRX MMF FE ATM SONET OC-3 2X5
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-5963LZ

• Applications: Ethernet
• Data Rate: 155MBd
• Wavelength: 1300nm
• Voltage - Supply: 2.97 V ~ 3.63 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Optical Fiber Type: TX/RX
• Optical Rise Time: 3/2.2ns
• Optical Fall Time: 3/2.2ns
• Jitter: 0.4/0.3ns
• Operating Temperature Classification: Commercial
• Peak Wavelength: 1308/1380nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 2.97V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.63V
• Output Current: 50mA
• Operating Temp Range: 0C to 70C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Recommended Handling Precautions
Avago recommends that normal static precautions be
taken in the handling and assembly of these transceivers
to prevent damage which may be induced by electrostatic
discharge (ESD).
The HFBR-5963xxZ series of transceivers meet MIL-STD-
883C Method 3015.4 Class 2 products.
Care should be used to avoid shorting the receiver data or
signal detect outputs directly to ground without proper
current limiting impedance.
Solder and Wash Process Compatibility
The transceivers are delivered with protective process
plugs inserted into the LC receptacle.
This process plug protects the optical subassemblies
during wave solder and aqueous wash processing and
acts as a dust cover during shipping.
These transceivers are compatible with either industry
standard wave or hand solder processes.
Figure 3. Recommended Decoupling and Termination Circuits
4
T X
R X
Notes:
C1 = C2 = C3 = 10 nF or 100 nF
* Loading of R1 is optional.
TRANSCEIVER INPUTS
10
1
TERMINATE AT
2
9
3
8
130 Ω
4
100 Ω
7
5
6
130 Ω
C2
C1
1 µH
1 µH
Z = 50 Ω
Z = 50 Ω
V CC (+3.3 V)
C3
Z = 50 Ω
Z = 50 Ω
Z = 50 Ω
10 µF
Shipping Container
The transceiver is packaged in a shipping container
designed to protect it from mechanical and ESD damage
during shipment or storage.
Board Layout - Decoupling Circuit, Ground Planes and
Termination Circuits
It is important to take care in the layout of your circuit
board to achieve optimum performance from these trans-
ceivers. Figure 3 provides a good example of a schematic
for a power supply decoupling circuit that works well
with these parts. It is further recommended that a con-
tiguous ground plane be provided in the circuit board
directly under the transceiver to provide a low inductance
ground for signal return current. This recommendation
is in keeping with good high frequency board layout
practices. Figures 3 and 4 show two recommended ter-
mination schemes.
130 Ω
V CC (+3.3 V)
R1*
4.7KΩ
DEVICE INPUTS
TERMINATE AT
130 Ω
100 Ω
TD-
TD+
RD+
RD-
SD
LVTTL
V CC (+3.3 V)
PHY DEVICE
LVPECL
LVPECL
V CC (+3.3 V)