HDSP-5538 Avago Technologies US Inc., HDSP-5538 Datasheet - Page 8

• Manufacturer Part Number: HDSP-5538
• Description: DISPLAY 7SEGMENT HER CC 0.56"
• Manufacturer: Avago Technologies US Inc.
• Type: Moduler

Specifications of HDSP-5538

• Display Type: 7-Segment
• Common Pin: Common Cathode
• Number Of Digits/alpha: +/-1 (overflow)
• Size / Dimension: 0.67" L x 0.49" W x 0.31" H (17.02mm x 12.57mm x 8.00mm)
• Digit/alpha Size: 0.56" (14.22mm)
• Color: Red
• Voltage - Forward (vf) Typ: 2.6V
• Current - Test: 20mA
• Millicandela Rating: 4.8mcd
• Wavelength - Peak: 635nm
• Power Dissipation (max): 105mW
• Package / Case: 10-DIP (0.600", 15.24mm), 9 Leads
• Number Of Digits: 1
• Character Size: 14.1 mm
• Illumination Color: High Efficiency Red
• Wavelength: 635 nm
• Operating Voltage: 2.6 V
• Operating Current: 40 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Luminous Intensity: 4800 ucd
• Package Type: DIP
• Product Length (mm): 17.1mm
• Product Height (mm): 8mm
• Product Depth (mm): 12.4mm
• Character Displayed: Numeric
• Emitting Color: Hi-Eff. Red
• Forward Voltage: 3.5V
• Forward Current: 40mA
• Dominant Wave Length: 636nm
• Power Dissipation: 105mW
• Total Thickness: 8mm
• Reverse Voltage: 5V
• Mounting: Through Hole
• Operating Temperature Classification: Industrial
• Pin Count: 10
• Configuration: Common Cathode
• Number Of Elements: 5
• Peak Wavelength: 635nm
• Reverse Current: 100uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Electrical
These display devices are composed of eight light emitting
diodes, with light from each LED optically stretched to
form individual segments and a decimal point.
The devices utilize LED chips which are made from GaAsP
on a transparent GaP substrate.
These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum
V
maximum power dissipation, may be calculated using the
following V
V
For: I
V
For: 10 mA ≤ I
Temperature derated strobed operating conditions are
obtained from Figures 1 and 2. Figure 1 relates pulse
duration (t
current to maxi mum dc current (I
2 presents the maximum allowed dc current vs. ambient
temperature. Figure 1 is based on the principle that the peak
junc tion temperature for pulsed operation at a specified
peak current, pulse duration and refresh rate should be
the same as the junction temperature at maximum DC
operation. Refresh rates of 1 kHz or faster minimize the
pulsed junction heating effect of the device resulting in the
maximum possible time average luminous intensity.
The time average luminous inten sity can be calculated
knowing the average forward current and relative ef-
ficiency characteristic, K
luminous intensity for a device case temperature of 25°C,
I
I
Example: For HDSP-4030 series
K
For DF = 1/5:
I
8
V
V
V
F
F
F
PEAK
(25°C), is calculated as follows:
(25°C) = [
(25°C) = [
MAX = 1.9 V + I
MAX = 2.15 V + I
values, for the purpose of driver circuit design and
F
= 1.00 at I
≥ 30 mA
= 4.5 mcd/segment
p
F
), refresh rate (f), and the ratio of maxi mum peak
20 mA
20 mA
20 mA
MAX models:
I
AVG
F
≤ 30 mA
PEAK
DC
] [K
] [1.00] [4.5 mcd]
PEAK
(21.8 :)
= 100 mA.
PEAK
(13.5 :)
PEAK
] [I
V DATA SHEET
, of Figure 3. Time average
PEAK
MAX/I
]
DC
MAX). Figure
The time average luminous inten sity may be adjusted for
operat ing junction temperature by the following expo-
nential equation:
I
where T
Mechanical
These devices are constructed utilizing a lead frame in a
standard DIP package. The LED dice are attached directly
to the lead frame. Therefore, the cathode leads are the
direct thermal and mechanical stress paths to the LED
dice. The absolute maximum allowed junction tempera-
ture, T
been established so that the worst case V
exceed this limit.
Worst case thermal resistance pin-to-ambient is 400°C/W/
Seg when these devices are soldered into minimum
trace width PC boards. When installed in a PC board that
provides RT
may be operated at higher average currents as shown in
Figure 2.
Optical
The radiation pattern for these devices is approximately
Lam bertian. The luminous sterance may be calculated
using one of the two following formulas.
L
L
V
Device
-3900
-4030/-4130/-5730/-4200
Device
-4030
-4130
-5730
-3900/-4200
V
V
(T
(cd/m
(footlamberts) =
J
) = I
J
MAX, is 105°C. The maximum power ratings have
J
2
V
= T
)
(25°C) e
A
PIN-A
+ P
D
=
[k(T
less than 400°C/W/Seg these displays
SI
A (m
I
A (ft
v
J
v
+ 25°C)]
(cd)
J-A
(cd)
2
2
)
)
Area/Seg.
mm
2.5
4.4
8.8
14.9
2
K
-0.0131/°C
-0.0112/°C
F
device does not
Area/Seg.
in
0.0039
0.0068
0.0137
0.0231
2