MT9HTF6472FY-53EB4E3 Micron Technology Inc, MT9HTF6472FY-53EB4E3 Datasheet - Page 2

• Manufacturer Part Number: MT9HTF6472FY-53EB4E3
• Description: MODULE DDR2 512MB 240FBDIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9HTF6472FY-53EB4E3

• Memory Type: DDR2 SDRAM
• Memory Size: 512MB
• Speed: 533MT/s
• Package / Case: 240-FBDIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240FBDIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 512MByte
• Chip Density: 512Mb
• Package Type: FBDIMM
• Maximum Clock Rate: 533MHz
• Operating Supply Voltage (typ): 1.8V
• Number Of Elements: 9
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 1: Key Timing Parameters
Table 2: Addressing
Table 3: Part Numbers and Timing Parameters – 512MB
Base device: MT47H64M8,
Table 4: Part Numbers and Timing Parameters – 1GB
Base device: MT47H128M8,
PDF: 09005aef81a2f1eb
htf9c64_128x72fy.pdf - Rev. C 12/09 EN
Parameter
Refresh count
Device bank address
Device configuration
Row address
Column address
Module rank address
MT9HTF6472FY-80E__
MT9HTF6472FY-667__
MT9HTF6472FY-53E__
MT9HTF12872FY-80E__
MT9HTF12872FY-667__
MT9HTF12872FY-53E__
Speed
Grade
Notes:
-80E
-667
-53E
Part Number
Part Number
1. The data sheet for the base device can be found on Micron’s Web site.
2. All part numbers end with a four-place code (not shown) that designates component, PCB, and AMB revi-
sions. Consult factory for current revision codes. Example: MT9HTF12872FY-667E1D4.
Nomenclature
Industry
PC2-6400
PC2-5300
PC2-4200
2
2
1
1
512Mb DDR2 SDRAM
Module
Density
Module
Density
1Gb DDR2 SDRAM
512MB
512MB
512MB
1GB
1GB
1GB
Configuration
Configuration
CL = 5
128 Meg x 72
128 Meg x 72
128 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
800
667
–
512MB, 1GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM
Data Rate (MT/s)
512Mb (64 Meg x 8)
16K A[13:0]
1K A[9:0]
4 BA[1:0]
512MB
CL = 4
1 S0#
Bandwidth
Bandwidth
533
533
533
8K
Module
Module
2
6.4 GB/s
5.3 GB/s
4.3 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CL = 3
Memory Clock/
Memory Clock/
400
400
3.75ns/533 MT/s
3.75ns/533 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
–
Data Rate
Data Rate
t
RCD (ns)
12.5
15
15
(CL-
(CL-
Clock Cycles
Clock Cycles
1Gb (128 Meg x 8)
© 2005 Micron Technology, Inc. All rights reserved.
t
t
5-5-5
5-5-5
4-4-4
5-5-5
5-5-5
4-4-4
RCD-
RCD-
16K A[13:0]
t
1K A[9:0]
RP (ns)
8 BA[2:0]
12.5
1 S0#
15
15
t
t
1GB
RP)
RP)
8K
Link Transfer
Link Transfer
Features
4.8 GT/s
4.0 GT/s
3.2 GT/s
4.8 GT/s
4.0 GT/s
3.2 GT/s
t
RC (ns)
Rate
Rate
55
55
55