MT9VDDT6472AY-335D1 Micron Technology Inc, MT9VDDT6472AY-335D1 Datasheet - Page 8
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MT9VDDT6472AY-335D1
Manufacturer Part Number
MT9VDDT6472AY-335D1
Description
MODULE SDRAM DDR 512MB 184DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT9VDDT6472AY-335D1.pdf
(13 pages)
Specifications of MT9VDDT6472AY-335D1
Memory Type
DDR SDRAM
Memory Size
512MB
Speed
333MT/s
Package / Case
184-DIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
184UDIMM
Device Core Size
72b
Organization
64Mx72
Total Density
512MByte
Chip Density
512Mb
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
1.575A
Number Of Elements
9
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
184
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Electrical Specifications
Table 8:
Input Capacitance
Component AC Timing and Operating Conditions
Table 9:
PDF: 09005aef808f912d/Source: 09005aef808f8ccd
DD9C16_32_64x72A.fm - Rev. E 11/07 EN
V
V
Symbol
DD
IN
, V
I
T
/V
OZ
I
A
I
DD
OUT
Q
Absolute Maximum Ratings
Module and Component Speed Grades
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
disabled
DRAM ambient operating temperature
DD
REF
/V
Module Speed Grade
Notes:
input 0V ≤ V
DD
Q supply voltage relative to V
1. For further information, refer to technical note
-26A
Stresses greater than those listed in Table 8 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated in each device’s data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades, as shown in Table 9.
-40B
-335
-262
-265
128MB, 256MB, 512MB (x72, ECC, SR): 184-Pin DDR SDRAM UDIMM
IN
on Micron’s Web site.
≤ 1.35V (All other pins not under
OUT
SS
≤ V
SS
DD
1
IN
Q; DQ are
≤ V
DD
8
;
Address inputs,
RAS#, CAS#, WE#, BA,
S#, CKE
CK, CK#
DM
DQ, DQS
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
TN-00-08: “Thermal
Electrical Specifications
-75E
-75Z
-5B
-75
-6
©2003 Micron Technology, Inc. All rights reserved.
Min
–1.0
–0.5
–18
–40
–6
–2
–5
0
Applications,” available
Max
+3.6
+3.2
+18
+70
+85
+6
+2
+5
Units
µA
µA
°C
°C
V
V