MT8VDDT3264AG-262G4 Micron Technology Inc, MT8VDDT3264AG-262G4 Datasheet - Page 12
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MT8VDDT3264AG-262G4
Manufacturer Part Number
MT8VDDT3264AG-262G4
Description
MODULE SDRAM DDR 256MB 184DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT8VDDT3264AG-335G6.pdf
(30 pages)
Specifications of MT8VDDT3264AG-262G4
Memory Type
DDR SDRAM
Memory Size
256MB
Speed
266MT/s
Package / Case
184-DIMM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Commands
Operation Truth Table, provide a general reference of
available commands. For a more detailed description
Table 8:
CKE is HIGH for all commands shown except SELF REFRESH; all states and sequences not shown are illegal or reserved
NOTE:
Table 9:
Used to mask write data; provided coincident with the corresponding data
pdf: 09005aef80867ab3, source: 09005aef80867a99
DD8C16_32_64x64AG.fm - Rev. G 9/04 EN
1. DESELECT and NOP are functionally interchangeable.
2. BA0–BA1 provide device bank address and A0–A11 (128MB) or A0–A12 (256MB
3. BA0–BA1 provide device bank address; A0–A9 (128MB, 256MB) or A0–A9, A11 (512MB) provide column address; A10
4. Applies only to read bursts with auto precharge disabled; this command is undefined (and should not be used) for READ
5. A10 LOW: BA0–BA1 determine which device bank is precharged. A10 HIGH: all device banks are precharged and BA0–
6. This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.
7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.
8. BA0–BA1 select either the mode register or the extended mode register (BA0 = 0, BA1 = 0 select the mode register; BA0
NAME (FUNCTION)
NAME (FUNCTION)
DESELECT (NOP)
NO OPERATION (NOP)
ACTIVE (Select bank and activate row)
READ (Select bank and column, and start READ burst)
WRITE (Select bank and column, and start WRITE burst)
BURST TERMINATE
PRECHARGE (Deactivate row in bank or banks)
AUTO REFRESH or SELF REFRESH (Enter self refresh mode)
LOAD MODE REGISTER
WRITE Enable
WRITE Inhibit
Table 8, Commands Truth Table, and Table 9, DM
HIGH enables the auto precharge feature (nonpersistent), and A10 LOW disables the auto precharge feature.
bursts with auto precharge enabled and for WRITE bursts.
BA1 are “Don’t Care.”
= 1, BA1 = 0 select extended mode register; other combinations of BA0–BA1 are reserved). A0–A11 (128MB) or A0–A12
(256MB
,
512MB) provide the op-code to be written to the selected mode register.
Commands Truth Table
DM Operation Truth Table
12
CS#
H
of commands and operations, refer to the 128Mb,
256Mb, or 512Mb DDR SDRAM component data sheet.
L
L
L
L
L
L
L
L
128MB, 256MB, 512MB (x64, SR)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
184-PIN DDR SDRAM UDIMM
RAS#
X
H
H
H
H
L
L
L
L
CAS#
,
X
H
H
H
H
L
L
L
L
512MB) provide row address.
WE#
H
H
H
H
X
L
L
L
L
Bank/Row
Bank/Col
Bank/Col
Op-Code
ADDR
Code
X
X
X
X
DM
©2004 Micron Technology. Inc.
H
L
NOTES
6, 7
1
1
2
3
3
4
5
8
Valid
DQS
X